Adhesion of poly(arylene ether benzimidazole) to copper and polyimides

Adhesion of poly(4,4′-oxydiphenylene pyromellitimide) to copper metal using a polymeric primer: Effects of miscibility and polyimide precursor origin

“…PAEBI was dissolved in NMP/cyclohexanone (50/50 in volume) to give a concentration of 1.7 wt.-% and filtered with a 1.0 lm Fluoropore filter. The PAEBI solution was spin-coated onto the precleaned copper sheets (3 cm 6 5 cm 6 2 mm in size) at 1100 rpm for 30 s and baked at 200 8C for 30 min as described previously in the literature 14) . The thickness of the PAEBI layer is estimated to be ca.…”

“…However, this polyimide is known to have a poor adhesion to the polymer itself as well as to metals and substrates which are used together in the fabrication of microelectronic devices [6][7][8][9][10][11][12][13][14] . In particular, the polyimide exhibits a very poor adhesion to copper metal, so that the polyimide film is easily delaminated from the copper when it is overcoated on copper metal [6][7][8][9][10][11][12][13][14] . Furthermore, its poly(amic acid) precursor was found to react with copper metal during the imidization process, consequently generating copper oxide particles which diffuse into the polyimide film [12][13][14] .…”

“…Lee and his coworkers 14) have reported the enhanced adhesion of poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA PI) to copper metal using poly(arylene ether benzimidazole) (PAEBI) as a copper capping material. In Full Paper: Poly(amic acid) (PAA) and poly(amic diethyl ester) (PAE) precursors of poly(4,49-oxydiphenylene pyromellitimide) (PMDA-ODA PI) were synthesized.…”

An NMR study on polycondensation reactions of 3,5-diamino-1,2,4-triazole with dianhydrides and diacyl chlorides

“…According to previous investigations , the 2N1H bonds of azole derivatives are believed to react with copper via a redox reaction and then form ionic complexes between the nitrogen and copper atoms, which would enhance the interfacial adhesion, preventing the contacts of water and oxygen to the copper surface. In general, polymers containing azole functional units are known to be thermally stable at elevated temperatures and easily form films which can play a role as an anti-corrosion barrier, in comparison to organic azole derivatives in low molecular weights [18][19][20][21][22][23][24][25] . For this reason, there are great emphases on research and development of polymeric inhibitors for anti-corrosion coatings of metals.…”

“…In particular, aromatic polyimides, such as poly(4,49-oxydiphenylene pyromellitimide) and poly(p-phenylene biphenyltetracarboximide), are widely used in the microelectronic industry as interdielectric layers, passivation layers and alpha-particle barriers, because of their high thermal stability, excellent properties, and easy processability [24][25][26][27][28][29][30] . Therefore, from the polycondensation of DAT with an aromatic dianhydride, one may make a poly(amic acid) precursor and its polyimide which is very useful as either an anti-corrosion barrier of or a polymeric adhesion promoter to copper.…”