Miscibility of polyimide with polymeric primer and its influence on adhesion of polyimide to the primed copper metal: Effect of precursor origin

Yu, Junrong; Ree, M.; Shin, Tae Jin; Wang, Xin; Cai, Wenfang; Zhou, Dongpeng; Lee, K.-W.

doi:10.1002/(sici)1099-0488(19991001)37:19<2806::aid-polb10>3.0.co;2-u

Cited by 12 publications

(3 citation statements)

References 14 publications

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“…Most of the polyimides reported to date were based on pure organic systems. Recently, research in studying the interaction of polyimides with metals, particularly the adhesion of polyimides to various metal substrates, has drawn significant attention due to their potential applications as interlayer dielectric materials in microelectronic industry . On the other hand, relatively little attention was paid to polyimides functionalized with metal complexes.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and Properties of Polyimide with Diazacrown Ether Moiety and the Corresponding Polymer Barium Complexes

2001

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A series of polyimides with diaza-18-crown-6 moieties on the main chain were synthesized by the reaction between 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and different macrocyclic diamine monomers. The polyimide barium complexes were also synthesized from the corresponding monomeric barium complexes. An X-ray crystal structure of one of the monomers was also determined. Good quality, free-standing polymer films were obtained by thermal imidization of the poly(amic acid) presursors. No decomposition of the barium complexes was found during the thermal imidization processes. The polyimides and their barium complexes exhibit different electronic absorption properties, which is attributed to the formation of charge-transfer excited states. The binding of barium ion to the polymer main chain may affect the energy level of the resulting charge transfer states. In addition, the emission properties of the polyimides with and without barium ion are also different. Changes in the emission spectrum were observed when the metal-free polyimide film was immersed in barium solution. These materials may serve as potential candidates as sensors for barium or other alkaline earth metals.

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Section: Introductionmentioning

confidence: 99%

Synthesis and Properties of Polyimide with Diazacrown Ether Moiety and the Corresponding Polymer Barium Complexes

2001

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“…14 In addition, it is also reported that the benzimidazole can improve the adhesion between polymeric materials such as epoxy or polyimide, and copper. 15,16 Generally, imidazoletype curing agents are widely used for epoxy curing. The chemical structure of the OSP material (benzimidazole) is also based on the imidazole system.…”

Section: Effect Of Osp On Adhesion Of Acf Jointsmentioning

confidence: 99%

Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish

Kim

Paik

2008

Journal of Elec Materi

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The effect of final metal finishes of Cu electrodes on the adhesion and reliability of anisotropic conductive film (ACF) joints was investigated. Two different metal surface finishes, electroless Ni/immersion Au (ENIG) and organic solderability preservatives (OSPs) coated on Cu, were selected in this study for ACF bonding. The adhesion strength of ACF/OSP joints was higher than that of ACF/bare Cu and ACF/ENIG joints. The fracture sites of the ACF/bare Cu and ACF/ENIG joints were ACF/metal interfaces, while those of ACF/OSP joints were inside the ACF. Transmission electron microscope (TEM) and Fourier-transform infrared (FT-IR) analyses showed that the OSP coating layer on the Cu electrodes reacted with the epoxy resin of the ACFs but still remained at the bonding interface. According to the in-depth X-ray photoelectron spectroscopy (XPS) analysis, additional C-N bonds formed after the OSP-epoxy reaction and the outermost nitrogen of the OSP layer participated in curing of the epoxy resin of the ACF. Therefore, the OSP layer acted as an adhesion promoter to ACFs. Furthermore, this role of the OSP layer enhanced the reliability of the ACF/OSP joints under high temperature and humid environments, as compared to the ACF/ENIG joints.

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“…Song et al reported that polymeric adhesion promoter, polybenzimidazole, which was the base OSP material, showed better adhesion strength because polybenzimidazole prevented the surface of copper from oxidation [8]. Besides, some reseachers reported that the benzimidazole could improve the adhesion between polymeric materials, such as epoxy or polyimide, and copper [9][10]. Generally, imidazole type curing agents are widely used for the epoxy curing and the reaction between benzimidazole in OSP and ACF can enhance the adhesion strength.…”

Section: Effect Of Surface Finish On Adhesion Of Acf Jointsmentioning

confidence: 99%

Effects of metal surface finish on the anisotropic conductive adhesives (ACAs) joints

Kim¹,

Paik²

2006

2006 8th Electronics Packaging Technology Conference

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This work was performed to investigate the effect of final surface finish of Cu electrodes on the adhesion and reliability of anisotropic conductive films (ACFs) joints. Two different materials, electroless Ni/immersion Au (ENIG) and organic solderability preservatives (OSPs), were selected because these materials has been most commonly used as the final surface finish materials in printed circuit board (PCB) industries. However, the effect of OSPs on the adhesion and reliability of ACF joints has not been studied.Therefore, 1) investigation of the adhesion of ACF/OSP joints, and 2) evaluation of the reliability of ACF/OSP joints were performed in this study. Then, the results of ACA/OSP joints were compared to those of ACF/ENIG to confirm the feasibility and reliability of ACF/OSP joints.For the electrical continuity test and reliability tests, patterned flexible substrate and FR4 rigid substrates were prepared. A flexible substrate was bonded to two types of organic substrates with different metal surface finishes, ENIG and OSP, by using ACFs. According to the result of contact resistance measurement, the initial contact resistances of OSP/ACF joints were almost the same as those of the ENIG/ACF joints about 15 m . Four reliability tests, 85 o C/85% RH test and thermal cycling (TC) test, high temperature storage test (HTST) and pressure cooker test (PCT) have been performed to verify the stability of ACF/OSP joints in high temperature and humid environments. According to the results of reliability tests, ACF/OSP joints showed better reliability than ACF/ENIG joints, particularly in the PCT test.Adhesion strengths of ACF/OSP joints were also higher than ACF/bare Cu and ACF/ENIG joints. The fractured site of ACF/bare Cu and ACF/ENIG joints was ACF/metal interface but that of ACF/OSP joints was ACF inside. TEM and FT-IR analyses showed that the OSP coating layer on Cu electrodes remained even after ACF bonding and it seemed to play as an adhesion promoter.

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Miscibility of polyimide with polymeric primer and its influence on adhesion of polyimide to the primed copper metal: Effect of precursor origin

Cited by 12 publications

References 14 publications

Synthesis and Properties of Polyimide with Diazacrown Ether Moiety and the Corresponding Polymer Barium Complexes

Synthesis and Properties of Polyimide with Diazacrown Ether Moiety and the Corresponding Polymer Barium Complexes

Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish

Effects of metal surface finish on the anisotropic conductive adhesives (ACAs) joints

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