Adherent diamond film deposited on Cu substrate by carbon transport from nanodiamond buried under Pt interlayer

Effects of copper interlayer on deposition and flexibility improvement of diamond microelectrode

“…Despite the fact that Cu is immiscible with W, the sputtered Cu layer with a nanocrystalline structure on the W substrate presents high activity. The diffusion kinetic of Cu layer and W substrate in these experiments must be distinguished with bulky Cu/W diffusion couple [38]. It is deduced that the Cu layer tends to dissolve into the W substrate.…”

CVD diamond growth from nanodiamond seeds buried under a thin chromium layer

“…This provides the advantage of achieving a high seeding density of ND on Si [20], which would be difficult to realize on Cr [12,21,22]. Such an approach was recently demonstrated in the case of a Pt over-layer for adhesion improvement on Cu [23]. We thoroughly examine the growth of the nanocrystalline (NCD) layer and suggest a model to explain the diamond growth mechanism in this case.…”