Preparation of diamond/Cu microchannel heat sink by chemical vapor deposition

Liu, Xuezhang; Luo, Hao; Xu, Shengmin; Yu, Zhi‐Ming

doi:10.1007/s11771-015-2590-y

Cited by 11 publications

(4 citation statements)

References 26 publications

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“…CVD deposition of diamond occurs at elevated temperature, and, as the substrate cools, the high thermal stress causes the diamond film to crack and buck. 36 Moreover, the poor affinity of Cu to carbon results in slow diamond growth, which makes pinholes hardly avoidable (Figure S3). 35 Figure 1.…”

Section: Resultsmentioning

confidence: 99%

An Ultrastrong Double-Layer Nanodiamond Interface for Stable Lithium Metal Anodes

Liu

Tzeng

Lin

et al. 2018

Joule

170

131

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The stability of the Li-electrolyte interface is critical to the practical applications of Li metal anodes. Correspondingly, we developed a high-quality nanodiamond protection layer to reinforce the native solid-electrolyte interphase on Li metal. A double-layer film design was proposed to enhance the defect tolerance of the artificial interface, improving the macroscopic uniformity of the Li-ion flux; the exceptional mechanical property of a modulus of >200 GPa can be realized, which effectively arrested dendrite propagation, resulting in controlled Li deposition and significantly improved cycling efficiency.

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Section: Resultsmentioning

confidence: 99%

An Ultrastrong Double-Layer Nanodiamond Interface for Stable Lithium Metal Anodes

Liu

Tzeng

Lin

et al. 2018

Joule

170

131

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“…Currently, many methods have been proposed for bonding diamond heat sink layers onto metals. The most common and mature method is to grow polycrystalline diamond layers on metals using CVD [17]. Therefore, this paper also chooses polycrystalline diamond as the heat sink layer.…”

Section: Optimization Of Modulator Designmentioning

confidence: 99%

Multi-Physical Analysis and Optimization in Integrated Lithium Niobate Modulator Using Micro-Structured Electrodes

Su,

Yang,

Guo

et al. 2023

Photonics

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With the increase in the modulation rate of thin-film lithium niobate (LiNbO3, LN) modulators, the multi-physical field coupling effect between microwaves, light, and heat becomes more significant. In this study, we developed a thin-film LN modulator model using undoped pure LN thin film and T-shaped slow-wave electrodes. Furthermore, we utilized this model to simulate the microwave heating and light heating situations of the modulator. The temperature of the LN modulator was analyzed over time and with different signal frequencies. We also studied the influence of temperature rise on microwave and light signals, and we analyzed the change of S parameters and the Phase Shift of the light signal caused by temperature rise. Finally, we improved the thermodynamic characteristics of the modulator by adding a diamond heat dissipation layer. The diamond was obtained through the Chemical Vapor Deposition (CVD) technique and was a polycrystalline diamond. After adding the diamond heat dissipation layer, the temperature rise of the modulator was significantly improved, and the adverse effects of temperature rise on microwave signals were also significantly reduced.

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“…Now, there are many ways to prepare bimodal nanocrystalline (BNC) materials, such as inert gas condensation, mechanical alloying, electrodeposition, crystallization from amorphous material, severe plastic deformation, cryomilling and so on, one of the most common methods is the conventional sintering method. It is clear that, when using the conventional sintering methods without any additives, controlling both density and grain size of the sintered samples at the same time is a challenging job [17][18]. Besides, Although a lot of work has been done on the preparation of bimodal alloys, there are only a few reports on BNC copper [19], especially with silver which have superior combinations of high strength and good ductility [20].…”

Section: Introductionmentioning

confidence: 99%

Preparation and Tensile Property of Nanostructured Cu-Ag Alloy with Bimodal Grain Size Distribution

Liu

Zhang

Han

et al. 2017

KEM

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Nanostructured Cu-Ag alloys with bimodal grain size distribution were prepared and their tensile deformation behaviors were studied. The alloys were processed by hot isostatic pressing of blends of nanoand micrometer-sized powder particles. The microstructure of the alloys consisted of nanograins with an average grain size of 40 nm and coarse-grains with an average grain size of 30 um. The bimodal structured alloy exhibited high tensile strengths 522 MPa and a large plastic strain to failure approximately 30%. Simultaneously, Their tensile stress-strain curves displayed a long work-hardening region, and their tensile ductility increased with increasing coarse-grained volume fraction. The high strength primarily results from the contribution of nanograins, while the enhanced ductility may be attributed to the improved strain hardening capability by the presence of coarse grains.

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Preparation of diamond/Cu microchannel heat sink by chemical vapor deposition

Cited by 11 publications

References 26 publications

An Ultrastrong Double-Layer Nanodiamond Interface for Stable Lithium Metal Anodes

An Ultrastrong Double-Layer Nanodiamond Interface for Stable Lithium Metal Anodes

Multi-Physical Analysis and Optimization in Integrated Lithium Niobate Modulator Using Micro-Structured Electrodes

Preparation and Tensile Property of Nanostructured Cu-Ag Alloy with Bimodal Grain Size Distribution

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