Additive Processes for Metals

Arnold, David P.; Saumer, Monika; Yoon, Yong-Kyu

doi:10.1007/978-0-387-47318-5_3

Cited by 4 publications

(2 citation statements)

References 49 publications

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“…The TCR is, for both typologies of samples, lower than that usually reported for bulk Au and Ag [30]. Such a reduction of TCR is commonly observed for both evaporated [31] and printed [32] metallic thin films and may be attributed to rapid cooling effects, impurities present inside the film and the polycrystalline nature of such thin films [33], [34].…”

Section: A Temperature Sensingmentioning

confidence: 58%

Woven Temperature and Humidity Sensors on Flexible Plastic Substrates for E-Textile Applications

et al. 2013

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In this paper, a woven textile containing temperature and humidity sensors realized on flexible, plastic stripes is presented. The authors introduce two different sensors fabrication techniques: the first one consists of a conventional photolithography patterning technique; the second one, namely inkjet-printing, is here presented as an effective, lowcost alternative. In both cases, we obtain temperature and humidity sensors that can be easily integrated within a fabric by using a conventional weaving machine. All the sensors are fully characterized and the performances obtained with the two different fabrication techniques are compared and discussed, pointing out advantages and drawbacks resulting from each fabrication technique. The bending tests performed on these sensors show that they can be successfully woven without being damaged. A demonstrator, consisting of a mechanical support for the e-textile, a read-out electronic circuit, and a graphical PC interface to monitor the acquisition of humidity and temperature values, is also presented and described. This paper opens an avenue for real integration between printed electronics and traditional textile technology and materials. Printing techniques may be successfully used for the fabrication of e-textile devices, paving the way for the production of large area polymeric stripes and thus enabling new applications that, at the moment, cannot be developed with the standard lithography methods.Index Terms-E-textiles, humidity and temperature sensors, inkjet-printing, plastic and flexible substrates, wearable electronics. Manuscript

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Section: A Temperature Sensingmentioning

confidence: 58%

Woven Temperature and Humidity Sensors on Flexible Plastic Substrates for E-Textile Applications

et al. 2013

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“…If ∼45 MPa of in-plane tensile stress is included in the calculation, the measured stiffness values align quite well. Such residual stresses are common in electroplated copper [12], but a detriment to the overall MEMI performance. As a result, the theoretical (stress-free) flat-band inductance is much higher than the experimentally measured flat-band inductance.…”

Section: Lumped Model Parameter Extractionmentioning

confidence: 99%

Microelectromechanical inductors with high inductance density via mechanical energy storage

Divakar

Zhang²,

Zito³

et al. 2012

J. Micromech. Microeng.

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This paper reports the design, fabrication and testing of microelectromechanical inductors (MEMIs) that show high electrical inductance by storing energy via a mechanically compliant flexure. The microfabricated MEMI structures comprise a simple electroplated Cu beam that is placed in a static magnetic field. Upon application of ac current, the conductor vibrates via electrodynamic interactions with the magnetic field. This electromechanical behavior manifests as a highly reactive (inductive) one-port electrical impedance. In this work, we explain the microfabrication processes and the subsequent characterization of a variety of test structures, which exhibit a peak quality factor up to 5.6 with net areal inductance densities of up to 3.5 µH/mm 2. These devices are envisioned as a passive energy storage component for exploring high-power-density electrical power converters.

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The MEMS Design Process

Lamers

Pruitt

2011

MEMS Reference Shelf

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Additive Processes for Metals

Cited by 4 publications

References 49 publications

Woven Temperature and Humidity Sensors on Flexible Plastic Substrates for E-Textile Applications

Woven Temperature and Humidity Sensors on Flexible Plastic Substrates for E-Textile Applications

Microelectromechanical inductors with high inductance density via mechanical energy storage

The MEMS Design Process

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