Accelerative reliability tests for Sn3.0Ag0.5Cu solder joints under thermal cycling coupling with current stressing

Zhang, Shuai; Zhao, Hongyun; Xü, Hongbo; Fu, Xing

doi:10.1016/j.microrel.2021.114094

Cited by 21 publications

(9 citation statements)

References 11 publications

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“…Initially, we speculated that this could be due to the formation of substandard solder joints within the devices. 23 To investigate this, we utilized thermal imaging cameras to examine potential defects in devices that had been stored at 125 and 150 °C for 100 and 500 h. The test process is illustrated in Figure 2b. The device is placed on an insulated foam board, and an infrared camera is used to observe the surface temperature distribution of the device when it is powered on.…”

Section: Resultsmentioning

confidence: 99%

“…It can be seen that the failure of the device under 150 °C is mainly caused by the increase in the internal resistance of the SAC305 solder layer. 23,47 The device, which had been stored for 500 h at 150 °C, was polished, and the interface was analyzed to further verify the above results. Figure 4a and b shows FESEM diagrams of the interface structure of p-and n-type legs at 150 °C, respectively.…”

Section: Resultsmentioning

confidence: 99%

“…Conventional electronic components are designed to last about 10 years; however, according to the “Cannikin Law”, the lifespan of the equipment is determined by the nonreplaceable parts with the shortest lifespan. Therefore, it is vital to ensure that the lifespan of m-TEDs exceeds that of the core components. − Given the immense demand for such devices, the potential losses due to device failures could be substantial. Hence, for the long-term development of m-TEDs, high reliability is indispensable.…”

Section: Introductionmentioning

confidence: 99%

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The Failure Mechanism of Micro Thermoelectric Devices under the Action of the Temperature Field

Lyu,

Yang,

Liu

et al. 2024

ACS Appl. Mater. Interfaces

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The micro thermoelectric device (m-TED) boasts features such as adjustable volume, straightforward structure, and precise, rapid temperature control, positioning it as the only current solution for managing the temperature of microelectronic systems. It is extensively utilized in 5G optical modules, laser lidars, and infrared detection. Nevertheless, as the size of the m-TED diminishes, the growing proportion of interface damages the device's operational reliability, constraining the advancement of the m-TED. In this study, we used commercially available bismuth telluride materials to construct the m-TED. The device's reliability was tested under various temperatures: −40, 85, 125, and 150 °C. By deconstructing and analyzing the devices that failed during the tests, we discovered that the primary cause of device failure was the degradation of the solder layer. Moreover, we demonstrated that encapsulating the device with polydimethylsiloxane (PDMS) could effectively delay the deterioration of its performance. This study sparks new insights into the service reliability of m-TEDs and paves the way for further optimizing device interface design and enhancing the device manufacturing process.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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The Failure Mechanism of Micro Thermoelectric Devices under the Action of the Temperature Field

Lyu,

Yang,

Liu

et al. 2024

ACS Appl. Mater. Interfaces

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“…The Sn-Ag-Ti-based solder can be applied without the flux or preliminary coating of substrates and is free from lead or cadmium, corresponding to the requirements of all the environmental initiatives for lead-free soldering (RoHS etc.) [ 15 ].…”

Section: Introductionmentioning

confidence: 99%

Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum

et al. 2022

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The aim of this research was to study the wettability and solderability of SiC ceramics by the use of an active solder of the type Sn5Sb3Ti in a vacuum by electron beam heating. This solder exerts a narrow melting interval, and only one thermal effect, a peritectic reaction, was observed. The liquidus temperature of the solder is approximately 243 °C. The solder consists of a tin matrix where the Ti6(Sb,Sn)5 and TiSbSn phases are precipitated. The solder wettability on a SiC substrate decreases with decreasing soldering temperature. The best wetting angle of 33° was obtained in a vacuum at the temperature of 950 °C. The bond between the SiC ceramics and the solder was formed due to the interaction of Ti and Ni with silicon contained in the SiC ceramics. The formation of new TiSi2 and Ti3Ni5Si6 phases, which form the reaction layer and thus ensure the bond formation, was observed. The bond with Ni is formed due to the solubility of Ni in the tin solder. Two phases, namely the Ni3Sn2 and Ni3Sn phases, were identified in the transition zone of the Ni/Sn5Sb3Ti joint. The highest shear strength, around 40 MPa, was attained at the soldering temperature of 850 °C.

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“…Additionally, as the reliability of the soldered joint, the thermal fatigue resistance, the heat resistance and ion migration resistance are very important. Then, there are many studies for fatigue [7,8], thermal fatigue [9][10][11], interfacial reaction (growth of intermetallic compounds) [12][13][14], creep [15,16] and ion migration [17,18] of various lead-free solder. In particular, reliable thermal fatigue properties of the solder joint are among the most important factors under operating conditions.…”

Section: Introductionmentioning

confidence: 99%

Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder

et al. 2021

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The effect of the addition volume of Ni on the microstructures and tensile and fatigue properties of Sn-6.4Sb-3.9Ag (mass%) was investigated using micro-size specimens. The addition of Ni into Sn-6.4Sb-3.9Ag tends to increase the number of grains formed in the solidification process and produce a high-angle grain boundary. An amount of 0.1% proof stress of Sn-6.4Sb-3.9Ag decreases with an increase in the Ni addition volume at a strain rate of 2.0 × 10−1 s−1. The effect of the addition of Ni into Sn-6.4Sb-3.9Ag on tensile strength is negligible at both 25 °C and 175 °C. The elongation of Sn-6.4Sb-3.9Ag decreases with an increase in the Ni addition volume at 25 °C according to the fracture mode change from ductile chisel point fracture to shear fracture. The effect of the addition of Ni into Sn-6.4Sb-3.9Ag on the elongation is negligible at 175 °C. The low cycle fatigue test result shows that the fatigue life does not degrade even at 175 °C in all alloys investigated. The fatigue life of Sn-6.4Sb-3.9Ag-0.4Ni (mass%) is superior to those of Sn-6.4Sb-3.9Ag and Sn-6.4Sb-3.9Ag-0.03Ni (mass%) in the high cycle fatigue area. The electron back scattering diffraction (EBSD) analysis result shows that fine recrystallized grains are generated at the cracked area in Sn-6.4Sb-3.9Ag-0.4Ni in the fatigue test at 175 °C, and the crack progresses in a complex manner at the grain boundaries.

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Accelerative reliability tests for Sn3.0Ag0.5Cu solder joints under thermal cycling coupling with current stressing

Cited by 21 publications

References 11 publications

The Failure Mechanism of Micro Thermoelectric Devices under the Action of the Temperature Field

The Failure Mechanism of Micro Thermoelectric Devices under the Action of the Temperature Field

Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum

Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder

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