2016 IEEE 34th International Conference on Computer Design (ICCD) 2016
DOI: 10.1109/iccd.2016.7753257
|View full text |Cite
|
Sign up to set email alerts
|

Accelerating pointer chasing in 3D-stacked memory: Challenges, mechanisms, evaluation

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
139
0

Year Published

2018
2018
2023
2023

Publication Types

Select...
5
2
1

Relationship

1
7

Authors

Journals

citations
Cited by 143 publications
(139 citation statements)
references
References 70 publications
0
139
0
Order By: Relevance
“…Hybrid Memory Cube (HMC) is developed by a number of different contributing companies [12,44]. Like HBM, HMC also enables a logic layer underneath the DRAM layers that can perform computation [6,42,43]. HMC is already integrated in the SPARC64 XIfx chip [101].…”
Section: D-stacked Memorymentioning
confidence: 99%
See 1 more Smart Citation
“…Hybrid Memory Cube (HMC) is developed by a number of different contributing companies [12,44]. Like HBM, HMC also enables a logic layer underneath the DRAM layers that can perform computation [6,42,43]. HMC is already integrated in the SPARC64 XIfx chip [101].…”
Section: D-stacked Memorymentioning
confidence: 99%
“…In contrast, processing-in-memory (PIM)-enabled devices such as 3D-stacked memory can perform simple arithmetic operations very close to where the data resides, with high bandwidth and low latency. With carefully designed algorithms for PIM, application performance can often be greatly improved (e.g., as shown in [6,42,43,92]) because the relatively narrow and long-latency bus between the CPU cores and memory no longer impedes the speed of computation on the data.…”
Section: Introductionmentioning
confidence: 99%
“…However, practical concerns regarding the successful integration of DRAM and processing units into the same chip have hindered the advancement of such NMC systems for many years. Recently, the advent of 3D stacking memories that employ massive through-silicon-vias (TSVs) provides larger bandwidth while allowing the integration of logic and memory into a stacked chip (e.g., [13,15,16,20,30]).…”
Section: Computing In Memorymentioning
confidence: 99%
“…Recent works (e.g., [4,15,16,17,18,19,20,21,22,23,24,25]) in both CMOS Static Random Access Memory (SRAM) and emerging non-volatile memories (NVMs) have demonstrated various CiM designs at different levels of memory hierarchy. The designs allow computation to occur exactly where data resides, thereby reducing energy and performance overheads associated with data movement.…”
Section: Introductionmentioning
confidence: 99%
“…Thus, during the last decade, scientists have experimented with the integration of novel algorithms that perform dynamic, in-memory data rearrangements of irregular structures [22,23]. The aim is to overcome (or partially hide) some of the aforementioned limitations.…”
Section: Introductionmentioning
confidence: 99%