Abnormal threshold voltage shift under hot carrier stress in Ti1−xNx/HfO2 p-channel metal-oxide-semiconductor field-effect transistors

Abstract

This work investigates the channel hot carrier (CHC) effect in HfO 2 /Ti 1Àx N x p-channel metal oxide semiconductor field effect transistors (p-MOSFETs). Generally, the subthreshold swing (S.S.) should increase during CHC stress (CHCS), since interface states will be generated near the drain side under high electric field due to drain voltage (V d). However, our experimental data indicate that S.S. has no evident change under CHCS, but threshold voltage (V th) shifts positively. This result can be attributed to hot carrier injected into high-k dielectric near the drain side. Meanwhile, it is surprising that such V th degradation is not observed in the saturation region during stress. Therefore, drain-induced-barrier-lowering (DIBL) as a result of CHC-induced electron trapping is proposed to explain the different V th behaviors in the linear and saturation regions. Additionally, the influence of different nitrogen concentrations in HfO 2 /Ti 1Àx N x p-MOSFETs on CHCS is also investigated in this work. Since nitrogen diffuses to SiO 2 /Si interface induced pre-N it occurring to degrades channel mobility during the annealing process, a device with more nitrogen shows slightly less impact ionization, leading to insignificant charge trapping-induced DIBL behavior. V

Physical and chemical mechanisms in oxide-based resistance random access memory

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