Abstract:A Universal Thermal Module™ (UTM™) has been developed for vacuum-integrated cluster RTP and MOCVD as well as stand-alone atmospheric RTP applications. The UTM™ architecture provides highly modular RTP and MOCVD tool configurations for various single-wafer thermal processes. The UTM™ design comprises a temperature-controlled UHV-grade process chamber as well as an ultraclean gearless wafer rotation assembly for improved temperature uniformity and enhanced built-in reliability. The UTM™ RTP employs bottom/backsi… Show more
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