2023
DOI: 10.1038/s41586-022-05579-z
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A universal interface for plug-and-play assembly of stretchable devices

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Cited by 167 publications
(134 citation statements)
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“…The matrix materials for both types and their hybrid systems are usually based on plastic films and soft elastomers, including polyimide (PI), polymeric polydimethylsiloxane, Ecoflex, and styrene-ethylene/butylenestyrene, among others. Some representative examples are shown in Figure 1a, including hybrid devices for sensing electrophysiological (EP) signals, 16 a skin-like optoelectronics for blood pressure monitoring, a shape memory polymer based neural electrode for neuromodulation, organic bioelectronics, and a stretchable diode made of fully rubbery materials.…”
Section: Introductionmentioning
confidence: 99%
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“…The matrix materials for both types and their hybrid systems are usually based on plastic films and soft elastomers, including polyimide (PI), polymeric polydimethylsiloxane, Ecoflex, and styrene-ethylene/butylenestyrene, among others. Some representative examples are shown in Figure 1a, including hybrid devices for sensing electrophysiological (EP) signals, 16 a skin-like optoelectronics for blood pressure monitoring, a shape memory polymer based neural electrode for neuromodulation, organic bioelectronics, and a stretchable diode made of fully rubbery materials.…”
Section: Introductionmentioning
confidence: 99%
“…(a) Representative examples of flexible electronics based on elastomer/plastics. From left to right, flexible hybrid devices with robust binding interfacing, skin-like optoelectronic system for continuous blood pressure monitor, shape memory polymer based neural electrode for peripheral nerve, epidermic bioelectronics based on organic conductive polymers, and stretchable devices made of fully rubbery diode . Pictures from left to right are referenced as follows.…”
Section: Introductionmentioning
confidence: 99%
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“…First, the inevitable Young's modulus mismatch between the rigid chips and the stretchable interconnection presents a great challenge to the stretchability requirement of the flexible system. 21 Second, the electrical interference propagates through interconnection from the flexible part resulting in a noise performance deterioration of the whole system. Finally, under the application scenario of rigid-soft hybrid electronic system, the drastic and repetitive deformation deteriorates the interconnection adhesion, leading to a sharp degradation of stability and reliability of the system.…”
Section: Introductionmentioning
confidence: 99%
“…For that, lots of critical technical problems still require to be solved as follows. First, the inevitable Young’s modulus mismatch between the rigid chips and the stretchable interconnection presents a great challenge to the stretchability requirement of the flexible system . Second, the electrical interference propagates through interconnection from the flexible part resulting in a noise performance deterioration of the whole system.…”
Section: Introductionmentioning
confidence: 99%