2011
DOI: 10.1007/978-3-642-17752-1_8
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A Temperature-Aware Time-Dependent Dielectric Breakdown Analysis Framework

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“…It manifests itself both in the gate stack of devices and across wires of an integrated system. We also assume two modeling papers: one for TDDB manifestation on wires [Bekiaris et al 2011] and one for devices [Kimura 1999]. In case we would like to systematically classify these two papers, we should further split the "irreversible mechanism" leaf of our classification framework (see Figure 10) into two complementary categories.…”
Section: Reusability and Extensibility Of The Proposed Classificationmentioning
confidence: 99%
“…It manifests itself both in the gate stack of devices and across wires of an integrated system. We also assume two modeling papers: one for TDDB manifestation on wires [Bekiaris et al 2011] and one for devices [Kimura 1999]. In case we would like to systematically classify these two papers, we should further split the "irreversible mechanism" leaf of our classification framework (see Figure 10) into two complementary categories.…”
Section: Reusability and Extensibility Of The Proposed Classificationmentioning
confidence: 99%