A surface micromachined silicon gyroscope using a thick polysilicon layer

Funk, K.; Emmerich, H.; Schilp, A.; Offenberg, M.; Neul, Reinhard; Lärmer, Franz

doi:10.1109/memsys.1999.746752

Cited by 44 publications

(15 citation statements)

References 3 publications

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“…Among many micromachined gyroscopes, Coriolis vibratory rate gyroscopes have demonstrated significant progress within the past decade satisfying the requirements of several applications, such as guidance, robotics, tactical-grade navigation, and automotive applications [1][2][3][4]. The performance of Coriolis rate gyroscopes can be boosted further by implementing symmetric and decoupled structures that allow easy mode-matching, while reducing the mechanical cross-talk between the drive-and sense-modes of the gyroscope.…”

Section: Introductionmentioning

confidence: 99%

A high-performance silicon-on-insulator MEMS gyroscope operating at atmospheric pressure

Alper

Azgın

Akın

2007

Sensors and Actuators A: Physical

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This paper presents a new, high-performance silicon-on-insulator (SOI) MEMS gyroscope with decoupled oscillation modes. The gyroscope structure allows it to achieve matched-resonance-frequencies, large drive-mode oscillation amplitude, high sense-mode quality factor, and low mechanical cross-talk. The gyroscope is fabricated through the commercially available SOIMUMPS process of MEMSCAP Inc. The fabricated gyroscope has minimum capacitive sense gaps of 2.6 m and a structural silicon thickness of 25 m, and it fits into a chip area smaller than 3 mm × 3 mm. The fabricated gyroscope is hybrid connected to a CMOS capacitive interface ASIC chip, which is fabricated in a standard 0.6 m CMOS process. The characterization of the hybrid-connected gyroscope demonstrates a low measured noise-equivalent rate of 90 • /h/Hz 1/2 at atmospheric pressure, eliminating the need for a vacuum package for a number of applications. R 2 -non-linearity of the gyroscope is measured to be better than 0.02%. The gyroscope has a low quadrature signal of 70 • /s and a short-term bias stability of 1.5 • /s. The angular rate sensitivity of the gyroscope is 100 V/( • /s) at atmospheric pressure, which improves 24 times to 2.4 mV/( • /s) at vacuum. The noise-equivalent rate of the gyroscope at 20 mTorr vacuum is measured to be 35 • /h/Hz 1/2 , which can be improved further by reducing the electromechanical noise.

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Section: Introductionmentioning

confidence: 99%

A high-performance silicon-on-insulator MEMS gyroscope operating at atmospheric pressure

Alper

Azgın

Akın

2007

Sensors and Actuators A: Physical

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“…The epi-poly process was developed originally by Bosch for fabrication of MEMS gyroscopes and accelerometers [19], [20]. The devices were fabricated on 100 mm wafers coated with low-stress nitride.…”

Section: A Fabricationmentioning

confidence: 99%

“…However, holes in the mirrors would add optical crosstalk and increase insertion loss, therefore devices without holes were manufactured in this work. Since the mirrors are much larger than the hole spacing (20 ) dictated by the MUMPS design rule, a long undercut etch ( 60 min) was required using the industry standard 49% HF release. This long HF etch attacked the heavily doped poly 1 layer, resulting in increased resistance or open circuits on this layer.…”

Section: A Fabricationmentioning

confidence: 99%

MEMS Tilt-Mirror Spatial Light Modulator for a Dynamic Spectral Equalizer

Bernstein

Dokmeci

Kirkos

et al. 2004

J. Microelectromech. Syst.

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This paper presents a linear array of tilting mirrors used to attenuate the various wavelengths in a DWDM optical signal. Attenuation of 21 dB at snap-down was achieved by the tilting mirrors, substituting for a liquid crystal spatial light modulator (SLM) in a commercial dynamic spectral equalizer (DSE). Linear fill factor of 92% was achieved, allowing closely spaced wavelength channels to be individually attenuated. A two layer polysilicon process with a thick epi-poly mirror was used to fabricate the SLM. Initial mirrors had a radius of curvature of 25 cm. A novel accelerated HF-H 2 SO 4 etch allowed 100 m wide mirrors to be undercut in 12 min with no etch release holes.[1101]Index Terms-optical dynamic spectrum equalizer (DSE), epipoly, HF release, mirror array, spatial light modulator (SLM).

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“…The integration can be categorized based on the use of single-crystalline-silicon (SCS)/polysilicon or multiple compound layers as the microstructure. Microstructures fabricated with SCS/polysilicon have excellent mechanical properties and relatively low stress, corresponding to lower cross-axis effects and excellent performance of sensor's functionality [5]. Multilayer microstructure such as CMOS MEMS based on foundry-oriented platform is also utilized to fabricate monolithic sensor chip [6].…”

Section: Introductionmentioning

confidence: 99%

A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process

Tseng

Yeh

Chang

et al. 2017

Proceedings of Eurosensors 2017, Paris, France, 3–6 September 2017

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This paper presents a monolithic three-axis accelerometer with wafer-level package by CMOS MEMS process. The compositions of the microstructure are selected from CMOS layers in order to suppress the in-plane and out-of-plane bending deflection caused by the residual stresses in multiple layers. A switched-capacitor sensing circuit with a trimming mechanism is used to amplify the capacitive signal, and decrease the output dc offset voltage to ensure the desired output voltage swing. The CMOS MEMS wafer is capped with a silicon wafer using a polymer-based material. The measured sensitivities with and without a wafer-level package range from 113 mV/G to 124 mV/G for the in-plane (x-axis, y-axis) accelerometer, and from 50 mV/G to 53 mV/G for the z-axis accelerometer, respectively.

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A surface micromachined silicon gyroscope using a thick polysilicon layer

Cited by 44 publications

References 3 publications

A high-performance silicon-on-insulator MEMS gyroscope operating at atmospheric pressure

A high-performance silicon-on-insulator MEMS gyroscope operating at atmospheric pressure

MEMS Tilt-Mirror Spatial Light Modulator for a Dynamic Spectral Equalizer

A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process

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