A study of adhesive improvement of a Cr-Ni alloy layer on a liquid crystal polymer (LCP) surface

Miyauchi, Kyoko; Watanabe, Hiroto; Yuasa, Makoto

doi:10.1016/j.porgcoat.2016.01.001

Cited by 12 publications

(13 citation statements)

References 13 publications

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“…It can be seen from Figure 5c that there is an increase in the ratio of the C=O (287 eV) peak to the C-O(286.3 eV) peak. 5 The percentage of the O=C-O (289 eV) peak has decreased. The mechanism of oxygen plasma treatment indicates that -OH groups will be generated from the split-up of the ester bonds (O=C-O).…”

Section: Analysis On Peel Strength and Bonding Mechanismmentioning

confidence: 99%

“…The mechanism of oxygen plasma treatment indicates that -OH groups will be generated from the split-up of the ester bonds (O=C-O). 5,35 The oxygen plasma treatment produces more hydrophilic groups on the surface, raising wettability LCP surface. Figure 5d,e show the water contact angle test results of the untreated and treated LCP films.…”

Section: Analysis On Peel Strength and Bonding Mechanismmentioning

confidence: 99%

“…In the first step, LCP surface plasma treatment produces hydrophilic groups, such as C=O groups, on the surface of LCP. 5,35 During this step, ester bonds were broken to generate -OH groups. 36 The introduction of these groups will strengthen the peel strength between LCP and copper because the hydroxyl group in the silane reacts with the oxidized copper layer.…”

Section: Analysis On Peel Strength and Bonding Mechanismmentioning

confidence: 99%

“…[1][2][3] Flexible printed circuit (FPC) board is playing an increasingly important role as the carrier supporting electrical interconnection. 4,5 The flexible copper-clad laminate (FCCL) is becoming more important to serve as the raw material of FPC. Liquid crystal polymer (LCP), one of the flexible substrates, has attracted great scientific research interest due to its lower dielectric constant, [6][7][8] lower dielectric dissipation factor, and reduced moisture absorption compared with other popular of substrates, 9 including polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), and polyimide (PI).…”

Section: Introductionmentioning

confidence: 99%

“…With the development of communication technology, electronic equipment is becoming flexible and wearable 1–3 . Flexible printed circuit (FPC) board is playing an increasingly important role as the carrier supporting electrical interconnection 4,5 . The flexible copper‐clad laminate (FCCL) is becoming more important to serve as the raw material of FPC.…”

Section: Introductionmentioning

confidence: 99%

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Enhancing peel strength between liquid crystal polymer and copper with plasma treatment, surface oxidation, and silane coating

Chen

Feng

et al. 2022

J of Applied Polymer Sci

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Liquid crystal polymer (LCP) has been employed as a major type of substrate in flexible printed circuit manufacturing due to its excellent electrical and mechanical properties. In order to improve the peel strength of LCP to copper, a three‐step process was proposed in this study. In the process, the surface of LCP was treated with oxygen plasma to create holes and increase the number of hydrophilic groups. The surface of copper was then oxidized and coated with silane coupling agent. Above surface treatment aimed to introduce amine group to facilitate the interconnection between copper and LCP and improve the surface roughness of the copper surface. The final samples were laminated by the above treated copper and LCP. In this study, different oxidation conditions were explored to analyze the morphology and composition of the copper surface after oxidation. The maximum peel strength of the sample prepared by this process was 8.92 N cm−1. This developed process can effectively reduce product thickness compared to current methods in industry and can reduce lamination temperature compared to previous studies.

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Section: Analysis On Peel Strength and Bonding Mechanismmentioning

confidence: 99%

Section: Analysis On Peel Strength and Bonding Mechanismmentioning

confidence: 99%

Section: Analysis On Peel Strength and Bonding Mechanismmentioning

confidence: 99%