A simple surface-emitting LED array useful for developing free-space optical interconnect

Bare, H.F.; Haas, Franz; Honey, David A.; Mikolas, David; Craighead, Harold G.; Pugh, Graham M.; Soave, R.

doi:10.1109/68.195994

Cited by 7 publications

(4 citation statements)

References 8 publications

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“…Interchip optical interconnect [2] can enable greater connectivity for parallel computing with the use of optical I/O pads and wavelength division multiplexing. High‐speed data communications based on optical interconnect structures have been demonstrated with polymer waveguides [7, 8], fiber image guides [9, 10], fiber ribbons [6, 11], and lens and mirror systems [12–18]. For the scenario of interchip communication, compatibility with printed circuits board (PCB) process and easy integration [19] are two main challenges.…”

Section: Introductionmentioning

confidence: 99%

Rigid poly(vinyl chloride) gelation in a Brabender measuring mixer. III. Transformation in the torque maximum

Tomaszewska

Sterzyński

Piszczek

2007

J of Applied Polymer Sci

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The processing and structural effects occurring in a poly(vinyl chloride) (PVC) compound processed in a plastograph, at the time at which the maximum value of the torque (point X on the torque curve) was reached, were studied. The unplasticized PVC compound was processed at various temperatures (150-2008C) with a kneader operating at rotors speeds of 5-40 min 21. The changes in the temperature of the compound due to kneading and its influence on the progress of PVC gelation were analyzed. The gelation progress was studied with differential scanning calorimetry, rheological measurements, and scanning electron microscopy. The maximum value of the torque occurred within the temperature range (170-1808C) of the PVC compound, and it was independent of the adjusted temperature of the mixing chamber. The processing of the PVC compound in the kneader, with high mechanical charges and a comparatively low adjusted temperature (150-1708C), spontaneously generated an effect of self-heating, resulting in an increasing temperature of the compound. Despite the surprisingly high degree of gelation (80-98%) of the PVC compound processed under these conditions (as determined by differential scanning calorimetry), the scanning electron microscopy observations indicated significant nonhomogeneity of the fracture surface. Consequently, the kneaded PVC compound at point X of the torque curve could be treated as a two-phase system composed of a liquid, amorphous phase and elements of a grain structure. The transformation of both phases (particularly the quantitative and qualitative changes), which was significantly dependent on the PVC temperature and the shear rate applied by the rotors, determined the state of the melted compound at this point of the torque curve.

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Section: Introductionmentioning

confidence: 99%

Rigid poly(vinyl chloride) gelation in a Brabender measuring mixer. III. Transformation in the torque maximum

Tomaszewska

Sterzyński

Piszczek

2007

J of Applied Polymer Sci

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Section: Introductionmentioning

confidence: 99%

Demonstration of a 5 Gb/s × 24 interchip optical interconnect system

Sang

Wang

2012

Micro & Optical Tech Letters

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An 850 nm 12‐channel vertical cavity surface emitting laser array, a photodiode array, microprocessor chips, embedded fiber‐optic waveguides, and microlens optical coupling elements are integrated onto the printed circuit board. The bidirectional 5 Gb/s × 24 optical interconnect system is successfully demonstrated for interprocessor communication through optical I/O pins. © 2012 Wiley Periodicals, Inc. Microwave Opt Technol Lett 54:1176–1179, 2012

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“…The phase contours are generated using the following, Xe (1) (2) 4d2 where Xe are the endpoints of a given fresnel zone, d is the specular distance modulo A., XI iS the horizontal displacement between object and image points, Z2 is the vertical displacement between object and image planes, and zi is the vertical displacement between object and DOE planes. (1) and (2) produce a set of (x,y) coordinates for each phase contour in the plane of the DOE. The x values in (2) are chosen to be equally spaced between the endpoints, Xe.…”

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confidence: 99%

“…The ideal surface relief within each zone is approximated by a series of steps or levels. The contours that bound each level within a given period are also generated using (1) and (2) where d is incremented by 7Jn where n is the number of levels used to approximate the ideal surface relief. The parameters used for the design of the DOE in this work were xi = 0.9mm, z = 6mm, and z 3mm.…”

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confidence: 99%

<title>Binary optics for optical interconnects</title>

Shank

Craighead

1994

SPIE Proceedings

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4-and 8-level diffractive optical elements (DOEs) are fabricated in silicon using electron beam lithography and reactive ion etching (RIE). An f/l.9, 1mm diameter, 4-phase-level, reflective, off-axis, imaging DOE is fabricated for use in a free-space optical interconnect. The absolute first order efficiency of the DOE is 73%. 8-level linear gratings are fabricated to determine processing tolerances for DOEs with first order diffraction efficiencies greater than 90%. DOE DESIGN FOR A REFLECTIVE FREE-SPACE INTERCONNECT ARCHITECTUREA focusing, reflective DOE was designed to image a 4x4 array of GaAsP LEDs1 onto a 4x4 array of metal-semiconductor-metal silicon photodetectors2. The operation of these components demonstrates a simple free-space interconnect architecture for use in stacked multi-chip modules (MCMs). Although the design of transmissive architectures is more common35, the use of a reflective geometry offers several advantages for both the MCM and DOE fabrication. Advantages for the MCM include patterned chips on a single side, the use of electrically active chips that face the same direction, and the use of semiconductor device substrates that are not required to be optically transparent. Advantages in the fabrication of reflective DOEs include buried diffractive and reflective surfaces6, shallower etched features, the ability to use the optic without an anti-reflection coating, and a decoupled substrate volume from the optics, which allows for the use of standard silicon processing techniques for the fabrication of the DOE7.The intersection of the plane of the optic with the family of confocal ellipsoids with foci at the desired object and image points, defines the phase zones of the DOE. The object and image points of the grating are taken to be the centers of the LED and photodetector arrays, respectively. The center of each phase zone is the point on the substrate where specular reflection connects the object and image points. This distance between object and image points through the specular point of the grating is defined as the specular distance. A schematic representation of the DOE is shown in figure l.The DOE is designed to he asymmetric in the x direction. This allows for off..axis operation which is necessary for reflective architectures which do not use beamsplitters. The DOE is symmetric in the y direction. Also shown are the O8194-15200/94/$6.OO SPIE Vol. 2216 / 189 Downloaded From: http://proceedings.spiedigitallibrary.org/ on 06/27/2016 Terms of Use: http://spiedigitallibrary.org/ss/TermsOfUse.aspx

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A simple surface-emitting LED array useful for developing free-space optical interconnect

Cited by 7 publications

References 8 publications

Rigid poly(vinyl chloride) gelation in a Brabender measuring mixer. III. Transformation in the torque maximum

Rigid poly(vinyl chloride) gelation in a Brabender measuring mixer. III. Transformation in the torque maximum

Demonstration of a 5 Gb/s × 24 interchip optical interconnect system

<title>Binary optics for optical interconnects</title>

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