2018
DOI: 10.1109/tcsi.2017.2733521
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A Silicon-Based Low-Power Broadband Transimpedance Amplifier

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Cited by 15 publications
(13 citation statements)
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References 17 publications
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“…Additionally, the chip occupies relatively small area compared with works implemented in SiGe processes. Peaking inductors are employed in [4,5,6,11,17,24,25,26] to extend bandwidth. Apart from that, technologies in [4,5] are faster than that of the proposed work.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Additionally, the chip occupies relatively small area compared with works implemented in SiGe processes. Peaking inductors are employed in [4,5,6,11,17,24,25,26] to extend bandwidth. Apart from that, technologies in [4,5] are faster than that of the proposed work.…”
Section: Resultsmentioning
confidence: 99%
“…Superior performance of SiGe BiCMOS over CMOS makes it possible to design high-speed circuits with high performance, while restrict power consumption to an acceptable level [20]. A couple of chipsets realized in SiGe BiCMOS were published [3,4,5,6,21,22,23,24,25,26]. A low-noise high-gain high-speed optical RX fabricated in 0.13-µm SiGe BiCMOS is proposed.…”
Section: Introductionmentioning
confidence: 99%
“…Although [280] had better NF and P dc than [305], its IIP 3 , A V and S 11 were worse. Meanwhile, other BiCMOS designs had higher P dc (11.7 to 95 mW) while some of them even had higher NF or lower A V [163,166,213,237,253,272,279,296,310,320,324,330,336,352].…”
Section: Optimum Work Of the 2010smentioning
confidence: 99%
“…-212, 214-221, 223, 225-236, 238, 240, 242-252, 254, 256-262, 264, 266-268, 270, 271, 273-277, 282, 283, 285-293, 295, 298, 302- 309, 311, 312, 314, 315, 317-319, 321, 322, 325-328, 331-333, 335, 337-341, 346-351, 355-358, 360], the BiCMOS[163,166,213,237,253,272,279,280,296,305,310,320,324,330,336,352] and the HEMT[174, 186, 187, 191, 222, 241, 255, 284, 294, 298-301, 313, 323, 329, 342-345, 353, 359].…”
mentioning
confidence: 99%
“…However, this has led to proportional increase in power consumption and chip area. The broadband characteristics of TIA can be retained by multi-stage design with distributed gain among different stages, but this increased the design complexity, power consumption and chip area [23], [24]. TIA proposed in [24] has demonstrated 3-dB bandwidth of 38.4 GHz, single-ended transimpedance gain of 66 dBΩ, and input-referred noise current density of 14.8 pA/…”
Section: Introductionmentioning
confidence: 99%