2017
DOI: 10.1002/jnm.2220
|View full text |Cite
|
Sign up to set email alerts
|

A silicon‐based dual‐material double‐gate tunnel field‐effect transistor with optimized performance

Abstract: The work focuses on optimizing the device parameters of a Si‐based dual‐material double‐gate tunnel field‐effect transistor for maximizing its efficiency. The efficiency is measured in terms of drain current, subthreshold swing, ION/IOFF ratio, and electron concentration in Si body. A numerical model of dual‐material double‐gate tunnel field‐effect transistor is developed using Silvaco, Atlas. Simulations are performed in Technology Computer Aided Design (TCAD) using Kane's band‐to‐band tunneling model. Based … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
4
0

Year Published

2019
2019
2024
2024

Publication Types

Select...
9
1

Relationship

0
10

Authors

Journals

citations
Cited by 13 publications
(5 citation statements)
references
References 36 publications
(48 reference statements)
0
4
0
Order By: Relevance
“…Traditional Si-based FETs require the channel thickness to be less than 1/3 of the channel length to effectively avoid short-channel effects. However, due to the limitations of traditional semiconductor materials, the thickness of the channel cannot be continuously reduced [55]. Those 2D materials with abundant valence band structures and readily controllable thicknesses exhibit great potential as next-generation channel materials [56].…”
Section: Working Mechanism In 2d Tribotronic Transistorsmentioning
confidence: 99%
“…Traditional Si-based FETs require the channel thickness to be less than 1/3 of the channel length to effectively avoid short-channel effects. However, due to the limitations of traditional semiconductor materials, the thickness of the channel cannot be continuously reduced [55]. Those 2D materials with abundant valence band structures and readily controllable thicknesses exhibit great potential as next-generation channel materials [56].…”
Section: Working Mechanism In 2d Tribotronic Transistorsmentioning
confidence: 99%
“…Where, and are are defined by material dependent Kane parameters, band gap materials and effective electron (or) hole mass. Regional and average electrical fields (Eavg) [28] are indicated in the EF component. Here m0 is the portion of the mass electron and me,mh are the effective mass of electrons and holes.…”
Section: Research Articlementioning
confidence: 99%
“…On the one hand, the silicon-based TFETs have low on-current about 3 decades lower than metal-oxide-semiconductor field-effect transistor (MOSFET) that causes their less competitive in high-performance applications ; Sabaghi et al, 2016(b); Dashtbayazi et al, 2015;Das, et al, 2018;Ashita, et al, 2019;Marjani, et al, 2016(b); Marjani, et al, 2016(c)). A number of designs have been proposed to further improve the on-current of the silicon-based TFETs including band-gap engineering (Luisier and Klimeck, 2010;Das, et al, 2015), low band-gap materials (Ganapathi, et al, 2010), high-k dielectric materials ; Jain et al, 2015;Noor, et al, 2017), source-pocket doping (Chang, et al, 2013;; Marjani, et al, 2016(b); Marjani, et al, 2017), vertical direction tunneling (Alper, et al, 2018), and extended source ; Marjani and Hosseini, 2014(b); Marjani, et al, 2017). Another way to overcome this weakness and improve the on-current is replacng silicon with high mobility of III-V material (Marjani, et al, 2016(b); Dorostkar and Marjani, 2018).…”
Section: Introductionmentioning
confidence: 99%