A review of connectors and joining technologies for electronic textiles

Abstract

Reliable connections between electronic circuits remain a challenge in electronic (e‐) textiles, where circuitry and components are embedded into clothing and other soft objects. E‐textiles that can measure physiological signals, deliver medical interventions, or act as a human‐computer interface are becoming increasingly pervasive, and the market for such products is predicted to grow dramatically in the coming years. Despite market predictions, several technical and production challenges persist, and these need to be overcome in order to realize commercial success. Challenges include a lack of standards for materials and manufacturing methods, issues with durability and washability, and incompatibility between textiles and electronic manufacturing methods. Joining technologies are a central part of this, as connecting e‐textile parts in a way that is electrically reliable and durable, without negatively impacting the form, fit, and function of a garment is challenging. This article reviews key joining technologies used in e‐textiles to date, demonstrating that few solutions have been specifically developed for e‐textile applications. Existing solutions are mostly connectors designed for use in rigid electronics, or textile closure mechanisms adapted to work with e‐textiles. A need for development of new joining technologies for e‐textiles, as well as further research into the performance of existing methods is highlighted.

Advances in the Robustness of Wearable Electronic Textiles: Strategies, Stability, Washability and Perspective

“…So far, various review articles have been published [113][114][115][116][117][118][119] mostly focusing on materials, fabrication strategies, architecture, multifunctional properties, and the application perspective of the wearable e-textiles, ignoring the importance of wash durability enhancement. Very few review articles [120][121][122] are available in the academia that entirely focus on washability and attempt to summarize different wash strategies, influencing parameters, and enhancement opportunities, but lack a pragmatic review that favors the improvement of the reliability and washability of e-textiles.…”

Low-Temperature Soldering of Surface Mount Devices on Screen-Printed Silver Tracks on Fabrics for Flexible Textile Hybrid Electronics

“…These high temperatures of soldering can deform, or even destroy, the textile substrate. Solder pastes can be replaced by conductive adhesives, but in the case of textile circuits, conductive adhesives do not usually provide good soldering results [ 36 , 37 , 38 ]. Thus, solder pastes ensure good conductivity and adequate fixation to the substrate [ 39 ], but their melting point must be compatible with the textile substrate [ 29 , 40 ].…”

Evaluation of a Spring-Finger Based, Magnetic Connector Concept for Reliable E-Textile Interconnects

“…A number of different approaches to this problem have been considered in the past [3]. Some use a permanent fixture such as an eyelet [4] or crimp [5] to attach to the textile, then use a standard rigid connector to attach to that.…”