A programmable CMOS transceiver for structural health monitoring

Tang, Xinyao; Zhao, Haixiang; Mandal, Soumyajit

doi:10.1109/cicc.2018.8357038

Cited by 7 publications

(4 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…As described in Section II, windowing ensures that the pulse is localized in the frequency domain (i.e., does not have significant side-lobes), which improves the accuracy of SHM measurements by avoiding the excitation of multiple propagating Lamb wave modes. The earlier (wired) SHM transceiver IC described in [24] used pulse-width modulation (PWM) to generate a close approximation to a Hamming-windowed pulse. However, PWM requires the use of a high-frequency clock (in the earlier design, 16× higher than the operating frequency) to generate narrow pulses, which significantly increases overall power consumption of the IC.…”

Section: B Dc-dc Convertermentioning

confidence: 99%

See 1 more Smart Citation

A CMOS SoC for Wireless Ultrasonic Power/Data Transfer and SHM Measurements on Structures

2022

View full text Add to dashboard Cite

This paper describes a highly-integrated CMOS system-on-chip (SoC) for active structural health monitoring (SHM). The chip integrates ultrasonic power and bidirectional half-duplex data transfer, a power management unit (PMU), and an ultrasound transceiver to enable wireless ultrasonically-coupled sensor SHM networks on structures. The PMU includes an active bias-flip rectifier with off-delay compensation, a high-efficiency dual-path DC-DC converter with inductor time-sharing, and five switched-capacitor DC-DC converters to generate multi-level spectrally band-limited pulses for guided-wave SHM. The chip was fabricated in a standard 180 nm process and has a die area of 2 × 2 mm 2 . Test results show power conversion efficiency (PCE) > 85% for the active rectifier, > 70% for the inductive DC-DC converter, and > 60% for the switched-capacitor DC-DC converters. Output pulses have a peak-to-sidelobe ratio (PSL) > 30 dB and worst-case out-of-band emissions < −30 dB, respectively. The SoC was integrated with a lowpower microcontroller and passive components to realize miniaturized (15 mm × 30 mm) wireless SHM nodes. A set of nodes was deployed on an SHM test-bed (carbon fiber reinforced polymer sheet) representing an airframe panel. Tests on this wireless network confirm both long-range ultrasound power/data transfer and the ability to detect structural damage.INDEX TERMS Energy harvesting, structural health monitoring (SHM), ultrasound power/data transfer.

show abstract

Section: B Dc-dc Convertermentioning

confidence: 99%

“…Table 1 compares the performance of this chip with other SHM ICs in the literature, including our own earlier work [24], [29]. This work achieves excellent spectral localization of the transmit waveform by suppressing both sidelobes and harmonics.…”

Section: G Performance Summary and Comparisonmentioning

confidence: 99%

A CMOS SoC for Wireless Ultrasonic Power/Data Transfer and SHM Measurements on Structures

2022

View full text Add to dashboard Cite

show abstract

“…Furthermore, the proposed signal chain is easy to implement even in a more compact and replicable technology, such as ASIC or custom chip. The advantages of the integrated electronic design for the sensor node are well described in the articles by Tang et al [52,53]. To reduce the footprint of a custom IC, it is necessary to keep in mind the difficulty of integrating the passive components used in active filters; in the project presented here, capacitor values lower than 5nF have been adopted.…”

Section: Resultsmentioning

confidence: 99%

A Versatile Analog Electronic Interface for Piezoelectric Sensors Used for Impacts Detection and Positioning in Structural Health Monitoring (SHM) Systems

Capineri

Bulletti

2021

Electronics

View full text Add to dashboard Cite

Continuous monitoring of mechanical impacts is one of the goals of modern SHM systems using a sensor network installed on a structure. For the evaluation of the impact position, there are generally applied triangulation techniques based on the estimation of the differential time of arrival (DToA). The signals generated by impacts are multimodal, dispersive Lamb waves propagating in the plate-like structure. Symmetrical S0 and antisymmetrical A0 Lamb waves are both generated by impact events with different velocities and energies. The discrimination of these two modes is an advantage for impact positioning and characterization. The faster S0 is less influenced by multiple path signal overlapping and is also less dispersive, but its amplitude is generally 40–80 dB lower than the amplitude of the A0 mode. The latter has an amplitude related to the impact energy, while S0 amplitude is related to the impact velocity and has higher frequency spectral content. For these reasons, the analog front-end (AFE) design is crucial to preserve the information of the impact event, and at the same time, the overall signal chain must be optimized. Large dynamic range ADCs with high resolution (at least 12-bit) are generally required for processing these signals to retrieve the DToA information found in the full signal spectrum, typically from 20 kHz to 500 kHz. A solution explored in this work is the design of a versatile analog front-end capable of matching the different types of piezoelectric sensors used for impact monitoring (piezoceramic, piezocomposite or piezopolymer) in a sensor node. The analog front-end interface has a programmable attenuator and three selectable configurations with different gain and bandwidth to optimize the signal-to-noise ratio and distortion of the selected Lamb wave mode. This interface is realized as a module compatible with the I/O of a 16 channels real-time electronic system for SHM previously developed by the authors. High-frequency components up to 270 kHz and lower-frequency components of the received signals are separated by different channels and generate high signal-to-noise ratio signals that can be easily treated by digital signal processing using a single central unit board with ADC and FPGA.

show abstract

“…This limits the chip's scalability and necessitates the use of an expensive and area-inefficient 0.25 µm Bipolar-CMOS-DMOS fabrication process. In more recent work, Tang et al demonstrated a compact single-channel 12.7 V pp transceiver for SHM [12,13]. However, this design still requires an external high-voltage power amplifier for typical use cases.…”

Section: Introductionmentioning

confidence: 99%

S-Parameter-Based Defect Localization for Ultrasonic Guided Wave SHM

Nyikayaramba

Murmann

2020

Aerospace

View full text Add to dashboard Cite

In this work, an approach for enabling miniaturized, low-voltage hardware for active structural health monitoring (SHM) based on ultrasonic guided waves is investigated. The proposed technique relies on S-parameter measurements instead of time-domain pulsing and thereby trades off longer measurement times with lower actuation voltages for improved compatibility with dense complementary metal-oxide-semiconductor (CMOS) chip integration. To demonstrate the feasibility of this method, we present results showing the successful localization of defects in aluminum and carbon-fiber-reinforced polymer (CFRP) test structures using S-parameter measurements. The S-parameter measurements were made on benchtop vector network analyzers that actuate the piezoelectric transducers at output voltage amplitudes as low as 1.264 Vpp.

show abstract

A programmable CMOS transceiver for structural health monitoring

Cited by 7 publications

References 9 publications

A CMOS SoC for Wireless Ultrasonic Power/Data Transfer and SHM Measurements on Structures

A CMOS SoC for Wireless Ultrasonic Power/Data Transfer and SHM Measurements on Structures

A Versatile Analog Electronic Interface for Piezoelectric Sensors Used for Impacts Detection and Positioning in Structural Health Monitoring (SHM) Systems

S-Parameter-Based Defect Localization for Ultrasonic Guided Wave SHM

Contact Info

Product

Resources

About