“…Recently, resistance random access memory (RRAM), one of the most promising candidates in emerging memory technologies, has attracted much attention by the silicon microelectronics industry due to several advantages: fast switching response and high scalability in per-bit energy consumption, excellent endurance, and retention during switching operations. − Furthermore, the simple two-terminal design of “metal/solid-electrolyte/metal” is also applied to a 3D stackable high-density data storage architecture . These features make it possible to employ the RRAM for many potential applications, such as computing-in-memory, data storage, and memory logic units. , Different metal oxide materials, including TiO x , , WO x , , NiO, , CuO, Ta 2 O 5 , ZrO, , etc., have extensively been investigated as the solid electrolyte based on the mechanisms of resistive switching (RS) in memory devices. In these devices, RS depends on the redox process and the migration of ionic species, resulting in electronically nanoconfined conducting filaments within the solid electrolyte or lateral homogeneity of functional interfaces. − However, there are still technical and operational requirements to address, for example, high-temperature processes, lower power consumption, reliability, and stability. , Thus, RRAM applications to advanced electronic systems still require improved materials and device architectures.…”