2016
DOI: 10.1016/j.spmi.2015.12.001
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A novel Silicon on Insulator MOSFET with an embedded heat pass path and source side channel doping

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Cited by 25 publications
(5 citation statements)
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“…We activated this recombination model along with SRH model to let ATLAS calculate recombination in SOI-MOSFETs using above relations simultaneously like literature. 4,29,30 FLDMOB model was added to consider field dependent mobility according to following relation: 30 [4] where E is the parallel electric field and μ n0 and μ p0 are the low-field electron and hole mobilities respectively. The BETAN and BETAP parameters are user-definable and their amounts are 2 and 1, by default.…”
Section: Gr-soi Structurementioning
confidence: 99%
See 1 more Smart Citation
“…We activated this recombination model along with SRH model to let ATLAS calculate recombination in SOI-MOSFETs using above relations simultaneously like literature. 4,29,30 FLDMOB model was added to consider field dependent mobility according to following relation: 30 [4] where E is the parallel electric field and μ n0 and μ p0 are the low-field electron and hole mobilities respectively. The BETAN and BETAP parameters are user-definable and their amounts are 2 and 1, by default.…”
Section: Gr-soi Structurementioning
confidence: 99%
“…With scaling, serious problems including high leakage current, short channel effects (SCE), high power consumption and self-heating effects (SHE)occur for nano-MOSFETs, and these effects degrade device electrical characteristics. [1][2][3][4][5][6][7] Therefore, there is a consensus in the community that, MOSFET scaling is approaching to its limits, and it is necessary to introduce new materials, structures and device concepts to continue performance improvement. 1,8,9 For this, to solve aforementioned problems, variety of structures with interesting architectures have been proposed, including FINFET structures, 10 tunnel field effect transistor (TFET) structures, 11 nanowires 12 and ground plane concept 10,13 beside doping engineering in the silicon film, 14 workfunction/dielectric engineering in the gate region 15 and buried oxide (BOX) engineering.…”
mentioning
confidence: 99%
“…According to Moore's law, however, it is unlikely that CMOS devices will retain their advantage due to short‐channel effects (SCEs). Although many recent papers present a modified version of metal–oxide–semiconductor field‐effect transistor (MOSFET)‐based structures to improve electrical performance, SCEs are still a significant obstacle for these new structures …”
Section: Introductionmentioning
confidence: 99%
“…11 The most important drawback of the SOI technology is increasing temperature in the device. [12][13][14][15] In the SOI technology the SiO 2 material blocks the heat transfer from the active region to the substrate. In this condition, the heat remains in the top silicon layer and the lattice temperature increases.…”
mentioning
confidence: 99%