A novel MRTD model for signal integrity analysis of resistive driven coupled copper interconnects

Abstract

Purpose This paper aims to model the coupled on-chip Copper (Cu) interconnects by using the multiresolution time-domain (MRTD) method. Design/methodology/approach The proposed model is a wavelet-based numerical method for analyzing signal integrity and propagation delay of coupled on-chip interconnects. Moreover, the dependency of crosstalk noise and delay on coupling parasitics (L12, C12) are analyzed. Findings The proposed MRTD method captures the behaviour of propagation delay and peak crosstalk noise on victim line against coupling parasitics, which is in close agreement with that of H simulation program with integrated circuit emphasis (HSPICE). The average error for the proposed model is less than 1 per cent with respect to HSPICE for the estimation of peak crosstalk noise voltage. Practical implications Simulations are performed using HSPICE and compared with those performed using the proposed MRTD method for global interconnect length with 130-nm technology, where the computations of the proposed model are carried out using Matlab. Originality/value The MRTD method with its unique features is tailored for modelling interconnects. To build further credence to this and its profound existence in the latest state-of-art works, simulations of crosstalk noise and propagation delay, for coupled Cu interconnect lines, using MRTD and finite-difference time-domain (FDTD) are executed. The results illustrated the dominance of MRTD method over FDTD in terms of accuracy.

Crosstalk Noise Analysis in Coupled On-Chip Interconnects Using MRTD Technique

“…Features and improved precision with SPICE, relative to the FDTD model. Rebelli et al [20,21] suggested the MRTD approach to evaluate the signal integrity of coupled Copper interconnect driven by linear resistive and a nonlinear CMOS dependent on the Daubechies scaling function at four extinct moments. and also, Rebelli et al [22] applied the MRTD approach driven to nonlinear CMOS using the nth-power law model to evaluate crosstalk noises in coupled on-chip interconnects.…”

Transient Analysis of Crosstalk Noise Effects in SWCNT Bundle On-Chip Interconnects Using MRTD Technique

“…Tong et al 23,24 proposed the MRTD model for transient analysis of two-conductor transmissions lines which outperformed the traditional FDTD in terms of numerical dispersion and accuracy when compared to SPICE. Rebelli et al 25,26 suggested that the MRTD approach is used to evaluate the signal integrity issues of a coupled copper interconnect driven by a linear resistive and a nonlinear CMOS dependent on the Daubechies scaling function at four extinct moments and also Rebelli et al 27 applied the MRTD approach driven to non-linear CMOS employing the nth power-law model to evaluate crosstalk noises in mutually coupled Multiwalled Carbon Nanotube interconnects. The crosstalk effects of SWCNT bundle interconnects have been investigated using the FDTD method with a resistive driver.…”