A novel metal-to-metal bonding process through in-situ formation of Ag nanoparticles using Ag₂O microparticles

Mechanical properties of nano-silver joints as die attach materials

“…4, a higher sintering temperature produces a joint of higher tensile strength [32,89]. A similar observation was recorded for the shear strength in Fig.…”

Evaluation of Interfacial Bonding Utilizing Ag2O-Derived Silver Nanoparticles Using TEM Observation and Molecular Dynamics Simulation

“…This technique has been widely accepted and Hu et al has reported a silver paste directly condensed from the silver nanoparticle solution through centrifugation [10]. The authors recently developed the novel bonding process through in-situ formation of silver nanoparticles from Ag 2 O instead of the filler material of the silver metallo-organic nanoparticles [11]. However, the precise study of the interfacial microstructure has not investigated yet.…”

Decrease in Process Pressure for Forming Au-to-Au Joints via Reduction Reaction of Ag₂O

“…In this bonding process, sintering can occur at a temperature lower than 300 C only when Ag exists in the form of nanoparticles, as their signi cantly high surface energy results in necking and subsequent agglomeration, causing relaxation and the minimization of their energy 5,8,10) . It can be concluded that quick ring is advantageous in that it allows one to bypass the low-temperature regime, resulting in an increase in the surface energy at higher temperatures.…”

“…The bonding substrate was copper coated with nickel (thickness of approximately 2 μm)/gold (thickness of approximately 0.7 μm) 3,6,8,12) . For bonding, the paste was placed on the bottom substrate (10 mm in diameter and 5 mm in length) using a 50-μm-thick stainless mask.…”

“…Studies exploring the use of nanoparticles as a bonding material have shown that they have great potential in terms of the joint shear strength [1][2][3][4][5][6] . Furthermore, we have successfully used Ag 2 O as a bonding material, replacing the nanoparticles as the original material and thus lling the cost gap between conventional solders and nanoparticle-based materials [7][8][9][10][11][12][13][14][15] . In this process, a bonding paste containing Ag 2 O and a reducing solvent is used as the solder material, generating Ag nanoparticles in-situ during the heating process.…”