Mechanical properties of nano-silver joints as die attach materials

Shear strength of copper joints prepared by low temperature sintering of silver nanoparticles

“…[2,9,11,12] The starting temperature of nanoparticle sintering is controlled by solvent evaporation and organic component burnout. The vaporization of the liquid phase and organic shell decomposition have been reported to occur at temperatures close to 150°C.…”

“…The threshold pressure is given by several factors, including particle size of Ag NPs. [2] The effect of external pressure on shear strength of joints prepared using Ag NPs was investigated in a pilot study. [3] It has been reported that a pressure of 5 MPa led to a 4-fold increase in shear strength compared to pressure-less bonding.…”

“…[1] Furthermore, the emergence of silicon carbide-based electronic devices, operating at high temperatures, has led to the emergence of novel, high-meltingpoint joining materials and new soldering approaches. [2,3] For high temperature soldering, there is a relatively small number of candidates compared to low temperature solders. [4] The most suitable alloys are Ag-, Au-and Zn-based binary systems with Sn, Ge, Al or Bi.…”

“…Nanoscale Ag pastes are promising joining materials due to their low sintering temperature. [2,3] These materials can be used for soldering at temperatures below 300°C. [6] Once sintered, the silver joints have high thermal and electrical conductivity and the high melting point of bulk silver (960°C) which makes them suitable for high temperature operation.…”

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

“…3,4 In such a harsh environment, a sintered Ag joint is one of the few viable options because its high melting temperature implies a stable mechanical joint with a low homologous temperature (%0.3 T m ). 5 In addition, the high thermal conductivity of sintered Ag allows devices such as light-emitting diodes and laser diodes to operate at high luminance efficiencies compared with other epoxy-based die-attach materials. 6,7 The increased interest in sintered Ag joints is reflected in the citation trend of one seminal paper concerning this technology (Fig.…”