A novel injection molded fluidic interposer for microfluidic applications

Abstract

The implementation of fluidic functions in 3D-MID (three dimensional molded interconnect devices) allows to create a new field of applications and enhanced system solutions. We report about the capabilities of MID for the packaging of chip modules with microfluidic functions. A mechanically stable and leak tight fluidic connection is needed between the microfluidic chip and the environment. For this purpose a fluidic interposer is fabricated by the LDS-process (laser direct structuring) and includes a metallization for electrical signals and channel structures for fluidic features. The presented interposer enables the transformation of fluidic ports from the macro-to the micro scale. To characterize the device, a microfluidic test chip made of silicon and glass (Borofloat ® ) has been fabricated and mounted on the fluidic interposer by a flip-chip vapor phase process. Finally the potential of the system is shown by testing maximum pressurization and fluidic sealing.

Flexible free-standing SU-8 microfluidic impedance spectroscopy sensor for 3-D molded interconnect devices application

“…In order to be applied in such 3-D systems, the sensor should have a flexible origin with the further possibility of a 3-D direct MID attachment. Manufacturing process of a 3D-MID substrate with fluidic channels and conducting paths fabricated by laser direct structuring (LDS) (Schmidt et al, 2012).…”