Soldering without the use of liquid fluxes is frequently demanded for assembly of electronic, optical and mechanical components because these chemicals and their residues can adversely affect performance. Chemical fluxes operate by removing oxide films from metal surfaces, which otherwise impede the spreading and wetting that is so essential for successful soldering and joint formation. Fluxless soldering processes employ alternative strategies to achieve the same end. Typically the oxide films are removed by reduction, displacement or dissolution; alternatively they are simply prevented from forming in the first place by suitably modifying the surfaces of the joints. The range of conditions required for successful fluxless soldering and how these are being achieved are reviewed with reference to specific case studies described in the scientific and technical literature.