Solder Paste Technology

Lee, Ning-Cheng

doi:10.1016/b978-075067218-4/50003-8

Cited by 7 publications

(3 citation statements)

References 4 publications

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“…After chip alignment, the assemblies are subjected to a reflow process in furnace with oxygen-free ambient and nitrogen-forming gas (5% H 2 þ 95% N 2 ). During this time, fluxing reactions such as acid-base reactions and oxidation-reduction reactions would occur (Lee, 2002). By-products from the fluxing reaction with the presence of water vapor could result in flux residues on the surface (Sini and Palmer, 1997).…”

Section: Flux Residuementioning

confidence: 99%

“…Flux activator is hygroscopic and acidic in nature. In the presence of conductive electrolysis and electrical field, it would lead to electrochemical migration as well as dendrite growth (Lee, 2002). In addition, flux residue could induce creeping current and result in electrical open circuit and/or interrupt RF signal integrity (Beddingfield, 1997).…”

Section: Flux Residuementioning

confidence: 99%

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Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

Yap

Talik

Sauli

et al. 2013

Microelectronics International

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Purpose -This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment process, could affect the package long-term performance. Design/methodology/approach -Thus, the flux-cleaning process was implemented and the cleanliness effect was evaluated. Cleaning experiments using a new water-based solvent were carried out to investigate the flux-cleaning efficiency. The test packages were then evaluated via ion chromatography (IC). Findings -Ion chromatograms show that there are high levels of ionic elements detected prior to the cleaning process. After the cleaning process, the contamination levels reduced significantly. Originality/value -The value of the work here is testing of the new environmental friendly water-based MPC w cleaning efficiency. The reduction of ionic contamination is thus reported.

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Section: Flux Residuementioning

confidence: 99%

Section: Flux Residuementioning

confidence: 99%

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

Yap

Talik

Sauli

et al. 2013

Microelectronics International

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“…Solder balling or beading is a widely known phenomenon in both lead-based (Lee, 2002) and lead-free (Biocca, 2007; Noor et al , 2016) reflow soldering. The phenomenon is when a solder bead or ball is created as a side effect or defect during the reflow soldering process of electronics components, which is usually dislocated from the soldering surface.…”

Section: Introductionmentioning

confidence: 99%

Investigation of solder beading phenomenon under surface-mounted electrolytic capacitors

Straubinger¹,

Tóth²,

Kerek

et al. 2022

SSMT

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Purpose The purpose of this paper is to study the solder beading phenomenon (referring to larger-sized solder balls) of surface-mounted electrolytic capacitors. Solder beading could induce failures by violating the minimal electrical clearance on the printed circuit board (PCB). In modern lead-free reflow soldering, especially in high-reliability industries, such as automotive, aeroplane and aerospace, detecting and preventing such defects is essential in reliable and cost-effective manufacturing. Design/methodology/approach The large size of the involved components may block the view of automatic optical inspection; therefore, X-ray inspection is necessary. To detect the failure mode, X-ray imaging, cross-section grinding, optical microscopy and Fourier transformed infrared spectroscopy were used. High-resolution noncontact profilometry and optical microscopy were used to analyse component designs. The surface mounting process steps were also analysed to reveal their dependence on the issue. Test methods were designed and performed to reveal the behaviour of the solder paste (SP) during the reflow soldering process and to emphasise the component design relevance. Findings It was found that the reduction of SP volume only reduces the failure rate but does not solve the problem. Results show that excessive component placement pressure could induce solder beading. Statistical analysis revealed that differences between distinct components had the highest effect on the solder beading rate. Design aspects of solder beading-prone components were identified and discussed as the primary source of the problem. Practical implications The findings can be applied in surface-mount technology production, where the total failure count and resulting failure costs could be reduced according to the findings. Originality/value This paper shows that component design aspects such as the low distance between the underside of the component and the PCB and blocked proper outgassing of volatile compounds of the SP can be root causes of solder beading under surface-mounted electrolytic capacitors.

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Effect of flux activator in reflow process related flux residue on the climatic reliability of surface-mount electronic devices

Lakkaraju

Jellesen

et al. 2023

J Mater Sci: Mater Electron

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This paper investigated the effect of flux activator used in reflow flux formulation on the electrochemical reliability of electronic devices. The focuses were placed on the perspective of surface insulation resistance (SIR), cleanliness, and its morphology transformation and redistribution behavior of flux residue under climatic exposure. Standardized accelerated climatic test on SIR comb-structure pattern was performed to benchmark the humidity interaction of the tested flux formulations used in solder paste. The influence of stand-off height for the surface-mount component on the humidity robustness was analyzed using an in-house designed dummy test rig and electrochemical impedance spectroscopy. Scanning electron microscopy and conductivity measurement was used to understand the hydrolytic degradation of the flux residue and the release of the conductive ionic residues during climatic exposure. Results indicate the spreading area and the hydrolytic degradation behavior of the flux residue were influenced by the type of flux activators used in flux formulation. The climatic reliability was influenced by the combined effect of the aggressiveness of flux activator and the spreading of the flux residue. However, result also shows that the climatic reliability of the surface-mount device can be improved by increasing the stand-off height of the components together with selected flux formulation.

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Solder Paste Technology

Cited by 7 publications

References 4 publications

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

Investigation of solder beading phenomenon under surface-mounted electrolytic capacitors

Effect of flux activator in reflow process related flux residue on the climatic reliability of surface-mount electronic devices

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