Abstract:Purpose
The purpose of this paper is to study the solder beading phenomenon (referring to larger-sized solder balls) of surface-mounted electrolytic capacitors. Solder beading could induce failures by violating the minimal electrical clearance on the printed circuit board (PCB). In modern lead-free reflow soldering, especially in high-reliability industries, such as automotive, aeroplane and aerospace, detecting and preventing such defects is essential in reliable and cost-effective manufacturing.
Design/met… Show more
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