A new on-chip interconnect crosstalk model and experimental verification for CMOS VLSI circuit design

Abstract

A new, simple closed-form crosstalk model is proposed. The model is based on a lumped configuration but effectively includes the distributed properties of interconnect capacitance and resistance. CMOS device nonlinearity is simply approximated as a linear device. That is, the CMOS gate is modeled as a resistance at the driving port and a capacitance at a driven port. Interconnects are modeled as effective resistances and capacitances to match the distributed transmission behavior. The new model shows excellent agreement with SPICE simulations. Further, while existing models do not support the multiple line crosstalk behaviors, our model can be generalized to multiple lines. That is, unlike previously published work, even if the geometrical structures are not identical, it can accurately predict crosstalk. The model is experimentally verified with 0.35-m CMOS process-based interconnect test structures. The new model can be readily implemented in CAD analysis tools. Thereby, this model can be used to predict the signal integrity for high-speed and high-density VLSI circuit design.

AC Power Loss and Signal Coupling in Very Large Scale Integration Backend Interconnects

“…14) Since all the transmission line coupling processes were induced through the distributed coupling capacitances, effective lumped parameters were introduced. 15) Therefore, using an HRS substrate can reduce the AC power loss, which is confirmed by the measured results shown in Fig. 4(a).…”