A new electropolishing technique for metallographic specimen preparation of zinc and zinc alloys

Kovacheva, R.; Gidikova, Neli; Lilova, Albena

doi:10.1016/1044-5803(92)90082-s

Cited by 6 publications

(2 citation statements)

References 2 publications

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“…Stefanescu D M prepared the cast samples of the alloy composition Al-4% Cu to study the effect of the surface refining process (SRP) on hardness, wear rate, and coefficient of friction of Al-4Cu [2] . Kovacheva R measured the graphite shape factors on the metallographic samples of iron-carbonsilicon alloys, and analyzed their evolution as a function of the chemical composition and the solid fraction [3] . Qing-Hong H E described results obtained with a new method for electropolishing metallographic specimens of zinc and zinc alloys.…”

Section: Instructionmentioning

confidence: 99%

Preparation Method for Metallographic Specimen of Iron-Carbon and Silicon-aluminium Alloy

Zhang

2022

J. Phys.: Conf. Ser.

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Abstracts Metallographic analysis is one of the means of testing and analyzing materials. To conduct metallographic analysis, we must prepare samples that can be used for microscopic observation. It is important to select and prepare representative samples, which is directly related to the correctness of microstructure analysis of metallography apspecimensimen. In this paper, the preparation process of the ferrocarbon alloy metallographic sample was analyzed and studied in detail, and some common defects were pointed out. The preparation process includes sampling, inlaying, polishing, polishing, and corrosion. Then, taking a silicon aluminum alloy (YZAlSi10) as an example, the preparation process is described, and the matters needing attention in the preparation process and the elimination of metallographic defects are analyzed. Finally, the accurate and clear microstructure of the metallographic structure is restored.

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Section: Instructionmentioning

confidence: 99%

Preparation Method for Metallographic Specimen of Iron-Carbon and Silicon-aluminium Alloy

Zhang

2022

J. Phys.: Conf. Ser.

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“…By using this method, the metal surface can be dissolved uniformly to form a smooth and bright outer layer. With the development of electrochemical polishing, the theoretical research and applied values on the change of voltage, current, and reaction parameters of electrolyte formulas have been matured [1][2][3]. The continuous miniaturization of ULSI integrated circuit fabrication, deep submicron line width, and the signal RC delay of multilayer wire in chips have become the bottleneck to chip operation speed.…”

Section: Introductionmentioning

confidence: 99%

Effects of Electrolyte Formulas on Electrochemical Polish Planarization of Pure Copper

Huang

Weng

et al. 2010

KEM

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Electrochemical polish technology could enhance the chemo-mechanical polishing efficiency of copper material. During the electrochemical polishing process, both the components and operation parameters of electrochemical polish solution are the key factors influencing planarization ability. This work measured the surface topography and roughness of copper material after mechanical polish by an atomic force microscope (AFM), and added glycerol in different ratios to the phosphoric acid (85 wt %), which was the main composition of experiment solution. Electrochemical polish was conducted within the potential action range in passivation area, and the surface topography and roughness of copper material after electrochemical polish was measured by AFM. The difference in surface topography of copper material after electrochemical polish was compared as well.The experiment indicated that after electrochemical polish in pure phosphoric acid for 50 sec, the surface roughness of copper material obviously decreased from 6.921nm (Ra) to 0.820nm (Ra), and the planarization was more obvious with the increase of electrochemical polish time. The above results could appear in different electrolyte formulas, indicating that electrochemical polish was a good processing method for copper material planarization. This work also proposed the effect of analyzing the electrochemical polish time on planarization through planarization efficiency. Based on the analysis, the planarization efficiency was decreased with the increase of electrochemical polish time, which indicated that longer electrochemical polish time did not yield better result. This work also found that the surface is not only flattened, but also glossed after electrochemical polish.

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Textured Electrodes: Manipulating Built‐In Crystallographic Heterogeneity of Metal Electrodes via Severe Plastic Deformation

et al. 2021

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Control of crystallography of metal electrodeposit films has recently emerged as a key to achieving long operating lifetimes in next‐generation batteries. It is reported that the large crystallographic heterogeneity, e.g., broad orientational distribution, that appears characteristic of commercial metal foils, results in rough morphology upon plating/stripping. On this basis, an accumulative roll bonding (ARB) methodology—a severe plastic deformation process—is developed. Zn metal is used as a first example to interrogate the concept. It is demonstrated that the ARB process is highly effective in achieving uniform crystallographic control on macroscopic materials. After the ARB process, the Zn grains exhibit a strong (002) texture (i.e., [002]Zn//ND). The texture transitions from a classical bipolar pattern to a nonclassical unipolar pattern under large nominal strain eliminate the orientational heterogeneity of the foil. The strongly (002)‐textured Zn remarkably improves the plating/stripping performance by nearly two orders of magnitude under practical conditions. The performance improvements are readily scaled to achieve pouch‐type full batteries that deliver exceptional reversibility. The ARB process can, in principle, be applied to any metal chemistry to achieve similar crystallographic uniformity, provided the appropriate temperature and accumulated strains are employed. This concept is evaluated using commercial Li and Na foils, which, unlike Zn (HCP), are BCC crystals. The simple process for creating strong textures in both hexagonal and cubic metals and illustrating the critical role such built‐in crystallography plays underscores opportunities for developing highly reversible thin metal anodes (e.g., hexagonal Zn, Mg, and cubic Li, Na, Ca, Al).

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A new electropolishing technique for metallographic specimen preparation of zinc and zinc alloys

Cited by 6 publications

References 2 publications

Preparation Method for Metallographic Specimen of Iron-Carbon and Silicon-aluminium Alloy

Preparation Method for Metallographic Specimen of Iron-Carbon and Silicon-aluminium Alloy

Effects of Electrolyte Formulas on Electrochemical Polish Planarization of Pure Copper

Textured Electrodes: Manipulating Built‐In Crystallographic Heterogeneity of Metal Electrodes via Severe Plastic Deformation

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