Implanting an organic semiconductor thin film (OSTF) device into an inexpensive FR4 substrate to design a microstrip antenna is demonstrated in this article. When the substrate was grounded for the device, special features of the frequency dependent I–V curves and the PN junction built‐in potential formed by joining of C60 (n‐type) and CuPC (p‐type) OSTFs can be obtained. The device can thus be activated and excited as a microstrip antenna by the side probe‐fed simultaneously. Meanwhile, the antenna gains can be modified by changing the thin film thickness as well as the source voltage of probe‐fed to excite the resonated mode of the structure of the microstrip antenna. © 2011 Wiley Periodicals, Inc. Microwave Opt Technol Lett 53:2569–2572, 2011; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.26338