2013
DOI: 10.1016/j.sse.2013.02.041
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A new characterization technique for SOI wafers: Split C(V) in pseudo-MOSFET configuration

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Cited by 19 publications
(10 citation statements)
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“…21 Capacitance is measured between the gate and interconnected source/drain contacts. The capacitance plateau in Fig.…”
Section: Developments In the Pseudo-mosfet Techniquementioning
confidence: 99%
“…21 Capacitance is measured between the gate and interconnected source/drain contacts. The capacitance plateau in Fig.…”
Section: Developments In the Pseudo-mosfet Techniquementioning
confidence: 99%
“…The split C-V measurement, frequently used to determine the effective carrier mobility in MOSFETs, is also feasible in Ψ-MOSFETs (20). The capacitance is measured between the gate and interconnected source/drain contacts.…”
Section: C-v Measurements In ψ-Mosfet Configurationmentioning
confidence: 99%
“…An useful, and recently proposed, 6 application of pointcontact techniques, on bare SOI wafers, is the determination of carrier mobility as a function of the substrate voltage or the inversion/accumulation charge density. To do so, Split-C(V) measurements (Figure 1(c)) are combined with the MOS-like I D (V G ) characteristics.…”
Section: Introductionmentioning
confidence: 99%