2008
DOI: 10.1109/tcsii.2007.916672
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A New Architecture for High-Density High-Performance SGT nor Flash Memory

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Cited by 5 publications
(5 citation statements)
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“…The F-N tunneling occurs when the applied electric field between the substrate and the CG is sufficiently large to overcome the potential barrier if the FG is charged. F-N tunneling is widely employed in actual flash memories since the voltage required for the write operation is lower than in HEI-based memory cells [33,34,35]. …”
Section: Technical Backgroundmentioning
confidence: 99%
See 1 more Smart Citation
“…The F-N tunneling occurs when the applied electric field between the substrate and the CG is sufficiently large to overcome the potential barrier if the FG is charged. F-N tunneling is widely employed in actual flash memories since the voltage required for the write operation is lower than in HEI-based memory cells [33,34,35]. …”
Section: Technical Backgroundmentioning
confidence: 99%
“…Regarding the physical size, the results found in [35] showed that NOR flash memory is scaled down to 50 nm with a cell size of 6.6 F 2 . Considering the same F as the one used for NAND flash cell size estimation—14 nm—the cell area of the NOR flash memory is 1293 nm 2 , which is approximately two times more than for NAND flash.…”
Section: Technical Backgroundmentioning
confidence: 99%
“…In either case, these blocks are independent of each other and the good blocks can be affected nothing but jumping over the bad ones [3] . There are some major work in the bad blocks management .To begin with, we should detect the block mark of every block in the chip and build up the block mapping table.…”
Section: The Bad Management Of Nandflashmentioning
confidence: 99%
“…It also indicates that the multiple-gate (MG) MOSFETs with the strong field confinement, prominent volume conduction, and high packing density can be the promising candidates for the future CMOS application. The novel structures for the surrounding-gate (SRG) MOSFETs with the high performance and scalability can be used for the memory DRAM cell [1]. To utilize this device for the memory cell application, it is mandatory to develop a feasible model.…”
Section: Introductionmentioning
confidence: 99%