A Multiresolution Time Domain (MRTD) Method for Crosstalk Noise Modeling of CMOS-Gate-Driven Coupled MWCNT Interconnects

Rebelli, Shashank; Nistala, Bheema Rao

doi:10.1109/temc.2019.2903728

Cited by 7 publications

(5 citation statements)

References 37 publications

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“…The Telegrapher's equations can be used to describe the coupled interconnects mathematically. The coupled on-chip interconnects are defined as [22,23] using these equations.…”

Section: Model Formulations For Two-coupled On-chip Interconnects Linementioning

confidence: 99%

“…Rebelli et al [20,21] suggested the MRTD approach to evaluate the signal integrity of coupled Copper interconnect driven by linear resistive and a nonlinear CMOS dependent on the Daubechies scaling function at four extinct moments. and also, Rebelli et al [22] applied the MRTD approach driven to nonlinear CMOS using the nth-power law model to evaluate crosstalk noises in coupled on-chip interconnects.…”

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confidence: 99%

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Crosstalk Noise Analysis in Coupled On-Chip Interconnects Using MRTD Technique

Gugulothu

2021

Preprint

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In this paper, the Crosstalk noise analysis of coupled on-chip interconnects have been analyzed. The multiresolution time-domain method (MRTD) is used to analyze the crosstalk noise model. The crosstalk induced propagation time delay and crosstalk peak voltage on the victim line of interconnects have been determined and compared to those of the conventional finite difference time domain (FDTD) method and validated with HSPICE simulations at the 22nm technology node. The results of the proposed method shows that crosstalk induced propagation delay in dynamic in-phase, out-phase and peak voltage timing, as well as the peak voltage value for functional crosstalk in the copper interconnects are an average error of less than 0.53% for the proposed model and HSPICE simulations. The results of the proposed model are closely similar to those of HSPICE simulations. Electromagnetic interference and electromagnetic compatibility of on-chip interconnects can also be addressed using the proposed method.

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“…The Telegrapher's equations can be used to describe the coupled interconnects mathematically. The coupled on-chip interconnects are defined as [22,23] using these equations.…”

Section: Model Formulations For Two-coupled On-chip Interconnects Linementioning

confidence: 99%

mentioning

confidence: 99%

Crosstalk Noise Analysis in Coupled On-Chip Interconnects Using MRTD Technique

Gugulothu

2021

Preprint

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“…Tong et al 23,24 proposed the MRTD model for transient analysis of two-conductor transmissions lines which outperformed the traditional FDTD in terms of numerical dispersion and accuracy when compared to SPICE. Rebelli et al 25,26 suggested that the MRTD approach is used to evaluate the signal integrity issues of a coupled copper interconnect driven by a linear resistive and a nonlinear CMOS dependent on the Daubechies scaling function at four extinct moments and also Rebelli et al 27 applied the MRTD approach driven to non-linear CMOS employing the nth power-law model to evaluate crosstalk noises in mutually coupled Multiwalled Carbon Nanotube interconnects. The crosstalk effects of SWCNT bundle interconnects have been investigated using the FDTD method with a resistive driver.…”

mentioning

confidence: 99%

“…Equations 10a and 10b need to be decomposed using the relationship in 27 to update the iterative equations of currents and voltages, which satisfies the connection coefficients b(i) provided by the connection coefficients b(i) given by…”

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confidence: 99%

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Transient Analysis of Crosstalk Noise Effects in SWCNT Bundle On-Chip Interconnects Using MRTD Technique

Gugulothu

Bhukya

2021

ECS J. Solid State Sci. Technol.

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Carbon nanotube bundles are being considered as a potential on-chip interconnect replacement for conventional copper on-chip interconnects in the nanoscale regime of recent IC technology. This paper analyzes the signal integrity analysis of CMOS gatedriven single-walled carbon nanotubes (SWCNTs) bundle on-chip interconnects. The wavelet-based numerical model Multiresolution Time Domain (MRTD) method is used for the transient analysis of SWCNTs bundles on-chip interconnects. The proposed MRTD model is used to perform transient analysis for parameters of signal integrity, peak crosstalk, and propagation delay estimations. The obtained results of the proposed MRTD model are compared with those of the conventional Finite Difference Time Domains (FDTD) model and it is validated with SPICE simulator at 32 nm technology node and also compared with multiwalled CNT (MWCNT) interconnects at 22 nm. The MRTD model results show excellent agreements to SPICE with less than 0.41% error. The elapsed CPU runtimes for the MRTD model are significantly less compared to SPICE. The MRTD model is used to interconnects the model with two and three lines and can be extended to an M-coupled line. The results of the proposed model are closely matched to those of SPICE simulations.

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