A multiple frequency signal generator for 802.11a/b/g VoWLAN type applications using organic packaging technology

Dalmia, S.; Bavisi, A.; Mukherjee, Souvik; Govind, V.; White, G. Edward; Swaminathan, Madhavan

doi:10.1109/ectc.2004.1320339

Cited by 9 publications

(11 citation statements)

References 7 publications

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“…In [14], a single-layer LCP shows excellent material characteristics up to 110 GHz. The single-layer LCP substrate for RF front ends has been characterized and applied to various applications such as low-noise amplifiers (LNAs), filters, baluns, and voltage-controlled oscillators (VCOs) [15]. Even though performances of RF front-end components are directly related to the quality factor (Q) of passives, this does not imply that every passive should have a high Q.…”

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confidence: 99%

High-Q Embedded Passives on Large Panel Multilayer Liquid Crystalline Polymer-Based Substrate

Yun

Swaminathan

2007

IEEE Trans. Adv. Packag.

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This paper presents high-Q embedded passives on a multilayer liquid crystalline polymer (M-LCP)-based substrate for a low-profile, compact, mixed-signal system integration with high performance. A low loss and a low water absorption are advantages of LCP. It is also lower-cost material than other high-frequency materials such as low-temperature cofired ceramic (LTCC) due to its compatibility to printed wiring board (PWB) process. Low loss characteristics of LCP provide high-Q passives such as inductors, capacitors, and matching networks. Seventy-six inductors and sixteen capacitors were characterized from three different 9 in 12 in multilayer LCP panels. Two different locations from each board were chosen to preliminarily validate the large panel process of the M-LCP substrate. The highest quality factor (Q) of 164 was achieved with 2.55 nH at 5.05 GHz. The inductors range from 1.45 to 23.11 nH and Qs range from 43 to 164. Inductors in various embedded layers were characterized for realization of 3-D integration in multilayer LCP substrate for multiband applications. To remove the parasitics from pads and interconnections, a two-step de-embedding technique was applied. The model-tohardware correlations are presented in this paper. Twelve 3-D capacitors were also designed and characterized, which provide more than double the capacitance of standard capacitors. Low-loss filters and baluns at 5 GHz were simulated and measured using the designed high-Q passives. The designed high-Q embedded passives on M-LCP-based substrates provide a systematic 3-D integration method for achieving low-profile, high-performance, and compact modules.Index Terms-Embedded passives, high-, liquid crystalline polymer (LCP), multilayer, three-dimensional (3-D) integration.

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confidence: 99%

High-Q Embedded Passives on Large Panel Multilayer Liquid Crystalline Polymer-Based Substrate

Yun

Swaminathan

2007

IEEE Trans. Adv. Packag.

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“…Although, this paper discusses work done primarily on passives on LCP based substrates, the authors have shown the application of this technology to realize other components such as single and multiband oscillators [12,20], low-noise amplifiers (LNAs) [13].…”

Section: Discussionmentioning

confidence: 99%

“…However, integration of high performance passives such as filters, in organic substrates or the PCB can eliminate the total dependence on LTCC and would help reduce module surface area, save costs and increase reliability. The work done in [6][7][8][9][10][11][12][13][14][15][16] illustrates organic process technologies, similar to PCB technology, that are being targeted as a cost-effective alternative to the primary technologies of choice namely ceramic based devices mentioned earlier. The work done in [6,[9][10][11]14,16] illustrates example of filters implemented using lumped element and transmission line topologies to realize components at 2.4GHz, SGHz, 1.9GHz and frequencies > 5GHz.…”

Section: Multilayer Ceramic (Mlc) [4]mentioning

confidence: 99%

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Liquid crystalline polymer based RF/wireless components for multi-band applications

Dalmia

Sundaram²,

White³

et al.

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)

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This paper presents for the first time the design, implementation, measurements, reliability data and integration of multiple RF components such as filters, baluns, diplexers, and a combination of the above on Liquid Crystalline Polymer (LCP) based substrates for communication standards such as 802.11 a/b/g, LMDWMMDS, sa1,ellitddigital TV, UWB, cellular and Bluetooth type applications.These components and process technologies are being targeted as a cost-effective high-performance, miniaturized alternative to the primary technologies of choice for multihand RF/wireless applications, namely, low-temperature co-fired ceramic (LTCC), multi-layer ceramic (MLC) and ceramic monoblock technologies.The first examples of this platform substrate technology are very compact 12"' fully packaged SMT 6ont-end filters with center frequencies of2.45, 5.25 and 5.775 GHz. One embodiment of the filter at 2.45 GHz, which is well suited for 802.11 b/g and Bluetooth type applications, provides a passband of 100 MHz with maximum inhand insertion loss less than 1.7dB at 2 5 T , greater than 25dB attenuation at 2700-2800 MHz, greater than lOdB attenuation below ;!.2GHz, greater than 20dB rejection at the second and third harmonic and inhand VSWR less than 1.5 matched to 50 Ohms at the input and output.

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“…Using the resonant property of lumped capacitors C1 and C2, which resonate with parasitic inductances LC1 and LC2 respectively, could also do this. For simplicity the only parasitic [7,8,12,and 131 by the authors were used as the guidelines for the design of stand alone components. Inductors in the range of 1nH-lOnH [7,8] can be embedded in stripline, CPW, microstrip or a combination of the above with Qs in the range of 30-200 based on the topology and configuration used.…”

Section: Design Of Filtersmentioning

confidence: 99%

Liquid crystalline polymer (LCP) based lumped-element bandpass filters for multiple wireless applications

Dalmia

White²,

Swaminathan³

2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535)

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This paper presents for the first time the design, implementation, measurements and reliability data of multiple RF filters on Liquid Crystalline Polymer based substrates for different communication standards such as 802.11 a/b/g, LMDSMMDS, cellular and Bluetooth applications. The first examples of this platform substrate technology are very compact 12mm3 fully packaged SMT front-end filters with center frequencies of 2.45 and 5.775 GHz. One embodiment of the filter at 2.45 GHz, which is well suited for 802.11 blg and Bluetooth type applications, provides a passband of 100 MElz with maximum inband insertion loss less than 2dB at 25OC, greater than 25dB attenuation at 2700-2800 MHz, greater than lOdB attenuation below 2.2GHz, greater than 20dB rejection at the second and third harmonic and inband VSWR less than 1.5 matched to 50 Ohms at the input and output. Index Terms -Bandpass Filters, Chip-type component, embedded passives, lumped element microwave circuits resonators, multilayer organic (MLO), multilayer RF circuits, packaging, printed circuit board (PCB).

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A multiple frequency signal generator for 802.11a/b/g VoWLAN type applications using organic packaging technology

Cited by 9 publications

References 7 publications

High-Q Embedded Passives on Large Panel Multilayer Liquid Crystalline Polymer-Based Substrate

High-Q Embedded Passives on Large Panel Multilayer Liquid Crystalline Polymer-Based Substrate

Liquid crystalline polymer based RF/wireless components for multi-band applications

Liquid crystalline polymer (LCP) based lumped-element bandpass filters for multiple wireless applications

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