Liquid crystalline polymer based RF/wireless components for multi-band applications

Dalmia, S.; Sundaram, Venkatesh; White, G. Edward; Swaminathan, Madhavan

doi:10.1109/ectc.2004.1320374

Cited by 18 publications

(14 citation statements)

References 14 publications

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“…The JMD process combines a thin LCP dielectric and low loss glass reinforced organic prepregs realize multilayer stack ups comprised of 4 to 12 layers (Fig. 1) [5][6][7]. From these constructions inductor and capacitor Qs above 200 can realized in very thin constructions.…”

Section: Substrate Technologymentioning

confidence: 99%

A compact single band 802.11 n front-end module for MIMO applications using multi-layer organic technology

Dalmia¹,

Fathima²,

Carastro³

et al. 2008

2008 IEEE Radio and Wireless Symposium

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This paper presents a novel module technology for 802.11 b/g/n applications. As an example, the authors demonstrate the first 6mm x 8mm x 1mm module which includes four antenna ports, three receive sections, and two transmit sections. The need for such modules has become imminent due to the arrival of multiple input multiple output (MIMO) based high data rate devices. The packaging technology used is multi-layer organic (MLO) technology comprising high performance liquid crystalline polymers (LCP). The transmit (TX) section includes embedded filters and baluns, silicon germanium (SiGe) based power amplifiers with control circuitry, harmonic filters, power detectors and single pole double throw switches. Similarly, the receive (RX) section includes embedded cellular rejection filters, low noise SiGe based amplifiers, and switches. Key features of the module consists of less than 3% EVM, < 160mA of current and less than 50dbm/MHz harmonics at 19dbm output power. The transmit filter baluns before the power amplifiers provide for greater than 25db rejection of cellular frequencies below 2GHz and transceiver spurs above 3GHz. The RX sections provides greater than 12db gain with 2.5db noise figure, and superior rejection of cellular frequencies. Finally, the isolation chain to chain (RX to RX and TX to TX) is greater than 25db which is imperative for MIMO performance.

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Section: Substrate Technologymentioning

confidence: 99%

A compact single band 802.11 n front-end module for MIMO applications using multi-layer organic technology

Dalmia¹,

Fathima²,

Carastro³

et al. 2008

2008 IEEE Radio and Wireless Symposium

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“…Most of the reported work on LCP for neural implants has focused on conventional semiconductor and PCB fabrication methods such as laser via ablation, sputtered metallization, and thin film processes [9][10][11]. The authors have earlier reported on multilayer LCP substrates for miniaturized and highly reliable RF modules with high density interconnect [12]. This paper reports on a novel approach to an integrated bioelectronic package with high density electrical feedthroughs that is capable of 1,024 stimulator channels in a 5 mm × 5 mm area.…”

Section: Introductionmentioning

confidence: 99%

High density electrical interconnections in liquid crystal polymer (LCP) substrates for retinal and neural prosthesis applications

Sukumaran

Cato

Liu

et al. 2011

2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

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Retinal prostheses implemented by means of electrical stimulation of retinal ganglion cells have been previously demonstrated with 16 and 60 channel microstimulator arrays. Blind patients with severe retinal degeneration (e.g., retinitis pigmentosa (RP) have been able to use these devices to navigate and read large letters. However, to dramatically improve the effectiveness of such prostheses, and to enable a variety of neural stimulation implants, channel densities of 1000 per cm 2 and higher are highly desirable. This paper reports on a novel approach to an integrated bioelectronic package with high density electrical feedthroughs, capable of 1024 stimulator channels in a 5 mm × 5 mm area using liquid crystal polymer (LCP) substrates to enable implantable retinal prostheses.A novel fusion bonding process was demonstrated to achieve fine pitch interconnections with high adhesion strength and biocompatible metal-polymer interfaces. Helium leak rates of 1 × 10 -9 mbar-l/sec were measured for LCP samples without feedthroughs, representative of penetration through the bulk LCP film, and leak rates of < 5 × 10 -8 mbar-l/sec were measured for feedthrough array samples, comparable to leak rates demonstrated for glass substrates with metallized vias.

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“…In contrast, liquid crystalline polymer (LCP) can provide high-Q passives embedded in the packaging substrate [9]. However, unlike LTCC, LCP allows designers to achieve completely integrated wireless systems [10] since the LCP process is compatible with PWB process such as FR-4. Therefore, it can be ultimately become the final PWB.…”

mentioning

confidence: 97%

High-Q Embedded Passives on Large Panel Multilayer Liquid Crystalline Polymer-Based Substrate

Yun

Swaminathan

2007

IEEE Trans. Adv. Packag.

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This paper presents high-Q embedded passives on a multilayer liquid crystalline polymer (M-LCP)-based substrate for a low-profile, compact, mixed-signal system integration with high performance. A low loss and a low water absorption are advantages of LCP. It is also lower-cost material than other high-frequency materials such as low-temperature cofired ceramic (LTCC) due to its compatibility to printed wiring board (PWB) process. Low loss characteristics of LCP provide high-Q passives such as inductors, capacitors, and matching networks. Seventy-six inductors and sixteen capacitors were characterized from three different 9 in 12 in multilayer LCP panels. Two different locations from each board were chosen to preliminarily validate the large panel process of the M-LCP substrate. The highest quality factor (Q) of 164 was achieved with 2.55 nH at 5.05 GHz. The inductors range from 1.45 to 23.11 nH and Qs range from 43 to 164. Inductors in various embedded layers were characterized for realization of 3-D integration in multilayer LCP substrate for multiband applications. To remove the parasitics from pads and interconnections, a two-step de-embedding technique was applied. The model-tohardware correlations are presented in this paper. Twelve 3-D capacitors were also designed and characterized, which provide more than double the capacitance of standard capacitors. Low-loss filters and baluns at 5 GHz were simulated and measured using the designed high-Q passives. The designed high-Q embedded passives on M-LCP-based substrates provide a systematic 3-D integration method for achieving low-profile, high-performance, and compact modules.Index Terms-Embedded passives, high-, liquid crystalline polymer (LCP), multilayer, three-dimensional (3-D) integration.

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Liquid crystalline polymer based RF/wireless components for multi-band applications

Cited by 18 publications

References 14 publications

A compact single band 802.11 n front-end module for MIMO applications using multi-layer organic technology

A compact single band 802.11 n front-end module for MIMO applications using multi-layer organic technology

High density electrical interconnections in liquid crystal polymer (LCP) substrates for retinal and neural prosthesis applications

High-Q Embedded Passives on Large Panel Multilayer Liquid Crystalline Polymer-Based Substrate

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