“…The coils and the core of miniaturized FSs are manufactured with PCB technology [ 23 , 25 , 27 , 33 , 35 , 38 , 39 , 40 , 41 ], allowing the construction sensors of several tens of millimeters or with different CMOS-compatible MEMS techniques [ 20 , 22 , 24 , 26 , 28 , 29 , 30 , 32 , 36 , 37 ], such as sputtering, electroplating, lithography, electron-beam evaporation, etc., which allow for achieving a further reduction in dimensions up to few millimeters. In [ 31 ], a conventional micro-printing technique is, instead, adopted to produce a mechanically flexible sensor.…”