A micro-machined Pirani gauge for vacuum measurement of ultra-small sized vacuum packaging

Wang, Xuefang; Liu, Chuan; Zhang, Zhuo; Liu, Sheng; Luo, Xiaobing

doi:10.1016/j.sna.2010.04.034

Cited by 44 publications

(23 citation statements)

References 16 publications

(24 reference statements)

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“…In recent years, numerous components require packaging for optimal operation, such as MEMS gyroscope sensors, micro-filters, MEMS ultrasonic sensors, high-end microaccelerometers and so on [1][2] . The vacuum packaging technique can improve the mechanical quality by reducing the air damping and protect the packaged components from the external environments [3][4][5] .…”

Section: Introductionmentioning

confidence: 99%

The Analysis of the Key Technologies of the Packaging Device Applied for the Epoxy Moulding Materials

Hong¹,

Hu²,

Wang³

et al. 2017

dtmse

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Abstract. The packaging device is the essential factor to determine the working efficiency and the packaging quality. The key technologies of the packaging device used for the multi-component moulding materials including the measuring-mixing system and the procedure control system were introduced and analyzed. It indicates that the measuring and mixing system composed of the volume measuring pump, the SK online mixer and the availably designed pouring valve is chosen after the comparison with the usually applied technologies. With the experimental results, the measuring accuracy can be limited to about 1% and the mixing units should be designed more than 32 joints. Furthermore, the main procedure control system is also displayed and described in detail in this paper.

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Section: Introductionmentioning

confidence: 99%

The Analysis of the Key Technologies of the Packaging Device Applied for the Epoxy Moulding Materials

Hong¹,

Hu²,

Wang³

et al. 2017

dtmse

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“…One popular idea is the miniaturization of Pirani gauges that use the dependence of thermal conductivity on ambient pressure (Wang et al, 2010;Dankovic et al, 2012). The concepts for micro-Pirani gauges have been improved for decades and in the meantime MEMS-type gauges with a very wide pressure range from 10 −5 to 10 3 mbar have been presented (Zhang et al, 2006;Völklein and Meier, 2007;Sun et al, 2013).…”

Section: Introductionmentioning

confidence: 99%

Concept for a MEMS-type vacuum sensor based on electrical conductivity measurements

Giebel

Köhle

Stramm

et al. 2017

J. Sens. Sens. Syst.

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Abstract. The concept of the micro-structured vacuum sensor presented in this article is the measurement of the electrical conductivity of thinned gases in order to develop a small, economical and quite a simple type of vacuum sensor. There are already some approaches for small vacuum sensors. Most of them are based on conservative measurement principles similar to those used in macroscopic vacuum gauges. Ionization gauges use additional sources of energy, like hot cathodes, ultraviolet radiation or high voltage for example, for ionizing gas molecules and thereby increasing the number of charge carriers for measuring low pressures. In contrast, the concept discussed here cannot be found in macroscopic sensor systems because it depends on the microscopic dimension of a gas volume defined by two electrodes. Here we present the concept and the production of a micro-structured vacuum sensor chip, followed by the electrical characterization. Reference measurements with electrodes at a distance of about 1 mm showed currents in the size of picoampere and a conductivity depending on ambient pressure. In comparison with these preliminary measurements, fundamental differences regarding pressure dependence of the conductivity are monitored in the electrical characterization of the micro-structured sensor chip. Finally the future perspectives of this sensor concept are discussed.

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“…However, the stress of the membrane must be considered to achieve narrower air gap for increasing dynamic range [6]. The second group is microbridge used as the heater and the substrate as heat sink [8][9][10]. It is easy to fabricate and compatible with many MEMS devices fabrication.…”

Section: Introductionmentioning

confidence: 99%

A single crystal silicon micro-Pirani vacuum gauge with high aspect ratio structure

Jiang

Wang

Zhang

2010

Sensors and Actuators A: Physical

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A micro-machined Pirani gauge for vacuum measurement of ultra-small sized vacuum packaging

Cited by 44 publications

References 16 publications

The Analysis of the Key Technologies of the Packaging Device Applied for the Epoxy Moulding Materials

The Analysis of the Key Technologies of the Packaging Device Applied for the Epoxy Moulding Materials

Concept for a MEMS-type vacuum sensor based on electrical conductivity measurements

A single crystal silicon micro-Pirani vacuum gauge with high aspect ratio structure

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