A method to alleviate hot spot problem in 3D IC

Manipulating nanoliter fluid circuits on an all-glass chip by the magnetic field

“…Moreover, there are hot spots on the chip, and solving such hot spots 36 , 37 requires targeted heat conduction. In the 3D integrated circuit, 38 where the hot spot effect is particularly serious, technologies such as eddy current, 39 loop, 40 thermal-sensing valve, 41 and nanofluid 42 have certain effects on enhancing heat transfer efficiency and other technologies, for example, the application of nanofluids in solar collector equipment 43 , 44 and related solar aircraft. 45 However, in the most critical active directional heat conduction method for flow, the technical difficulty lies in how to build a closed circulation fluid channel on a hard silicon wafer (or in glass) and drive the fluid in it to perform microcirculation flow.…”

Thermal management of 3-D integrated circuits with special structures

“…By using the through silicon vias (TSVs) to realize vertical electrical interconnection of different layers, the three-dimensional integrated circuits (3-D ICs) provide a promising option to build high-performance compact ICs, which have attracted a lot of attention in the academic community and the electronic industry [1][2][3][4]. Compared with the traditional two-dimensional integrated circuits(ICs), the 3-D ICs have many advantages in low power consumption, good noise immunity, large packaging density and fast speed due to reduced wire length/low wire capacitance [5][6][7].…”

Thermal optimization of a 3-D integrated circuit

“…In the latest decade, the 3-D integrated circuit (3-D IC) technology has attracted wide attention in the semiconductor industry [1][2][3][4][5][6], which has been emerging as a powerful tool for satisfying the requirement of integrated circuit packaging so as to extend greatly the space of IC development and overcome completely the drawbacks of 2-D IC. The way to realization of the 3-D packaging structure is stacking, which has many advantages in an increased speed, a large packaging density, a low weight/volume, and reduced power consumption and footprint [7][8][9][10][11][12][13][14][15][16].…”