Thermal management of 3-D integrated circuits with special structures

Wang, Kang‐Jia; Li, Cuiling

doi:10.2298/tsci200115109w

Cited by 3 publications

(1 citation statement)

References 26 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…With the development of micromachining technology, microchannel heat sink structure has been widely used in the thermal optimization design of 3D integrated circuits [1][2][3][4]. According to the theory of convection heat transfer in microchannel, the heat transfer performance of microchannel heat sink can be improved by increasing the heat transfer surface area of the microchannel heat sink or improving the heat transfer performance of the fluid [5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Optimization of open micro-channel heat sink with pin fins by multi-objective genetic algorithm

Jiang

Zhang

2022

Therm sci

View full text Add to dashboard Cite

Microchannel heat sink is an effective way to solve the heat dissipation problem of electronic devices because of its compact structure and outstanding heat dissipation ability. In order to obtain the high efficiency and low resistance microchannel heat sink , a new structure of open rectangular microchannel heat sink with pin fins was proposed to enhance heat transfer. The orthogonal test method was used to design the experiment, and the three-dimensional software Solidworks was used to establish 25 groups of open rectangular microchannel heat sink with pin fins structure model which has different structural parameters. The numerical calculation was carried out with ANSYS Fluent simulation software and the experimental values with the structural parameters of the microchannel heat sink as variables were obtained. According to the simulated experimental values, the objective functions of thermal resistance and pumping power were constructed, and the agent model between objective functions and the optimization variables were established. The Pareto optimal solutions of objective functions were calculated by non dominated sorting genetic algorithm NSGA-II, which was analyzed by k-means clustering analysis and five clustering points were obtained, and five clusters points were compared and verified by simulation. it was found that there was effective tradeoff points between the highest and lowest points of the five clustering which can make both the pumping power and thermal resistance within the optimal range, so as to obtain the optimal microchannel heat sink.

show abstract

Section: Introductionmentioning

confidence: 99%

Optimization of open micro-channel heat sink with pin fins by multi-objective genetic algorithm

Jiang

Zhang

2022

Therm sci

View full text Add to dashboard Cite

show abstract

Thermal modeling and analysis of 3-D integrated circuits with irregular structure

Rao

Liu

Wang³

et al. 2023

THERM SCI

View full text Add to dashboard Cite

Considering the manufacturing and packaging process, three-dimensional integrated circuits design often requires irregular chip structures. Three-dimensional integrated circuits with irregular structures can facilitate differentiated chip design and reduce manufacturing costs. Highly complex through-silicon vias have not been considered in past thermal modeling and analysis of irregularly structured three-dimensional integrated circuits. Thus, a detailed model of a three-layer irregularly structured 3D integrated circuit with through-silicon vias and microbumps is developed, and an analytical method based on the thermal resistance network model is proposed to extract the equivalent thermal conductivity of through-silicon vias and microbumps, the accuracy of which is verified by a 3D finite element simulation method. The results show that the maximum temperature and temperature gradient obtained by the equivalent model simulations agree well with the detailed model results, proving the validity of the equivalent model. To save the computational cost, the effects of heat source area, power setting and through-silicon vias structure parameters on the maximum temperature are studied by numerical simulation method based on the equivalent model. Heat source area equal to the overlap between chip layers, high power chips close to the heat sink, and reducing through-silicon vias pitch can better reduce the maximum temperature. The results provide a reference value for thermal design and optimization of three-dimensional integrated circuits with irregular structures.

show abstract

A fractal-fractional model for complex fluid-flow with nanoparticles

2023

THERM SCI

View full text Add to dashboard Cite

Nanoparticles play an important role in nanofluids to enhance thermal conduction, and can be easily controlled by a magnetic force, so it can be widely used in nano/micro devices. This paper gives two mathematical models to describe the nanofluid flow, one is an approximate continuum model, in which the homotopy matching is used to deal the discontinuity between the fluid and nanoparticles, and the other is to use the conservation laws in a fractal space. The models give new physical insight into the particle fluid-flow.

show abstract

Thermal management of 3-D integrated circuits with special structures

Cited by 3 publications

References 26 publications

Optimization of open micro-channel heat sink with pin fins by multi-objective genetic algorithm

Optimization of open micro-channel heat sink with pin fins by multi-objective genetic algorithm

Thermal modeling and analysis of 3-D integrated circuits with irregular structure

A fractal-fractional model for complex fluid-flow with nanoparticles

Contact Info

Product

Resources

About