Thermal optimization of a 3-D integrated circuit

Abstract

In a 3-D integrated circuit the heat source distribution has a huge effect on the temperature distribution, so an optimal heat source distribution is needed. This paper gives a numerical approach to its thermal optimization, the result can be used for 3-D integrated circuit optimal design.

A new fractional thermal model for the Cu/Low-k interconnects in nanometer integrated circuit

“…The thermal problems on the metal interconnects are becoming more and more serious, especially the continuous rise of the temperature on the metal interconnects has become an important limiting factor in the design of high performance integrated circuit chips. The high temperature distribution on the metal wire will directly deteriorate the circuit performance and result in a circuit electromigration failure, which will affect the reliability of the device [5][6][7][8].…”