“…Advances in the process technologies allowed manufacturing tiny MOS transistors with deepsub-micron gate widths and lengths featuring single traps. The study of tiny transistors featuring RTS noise showed that the drain current switching events correspond exactly to the carriers emission and release and bias voltage dependence of the this phenomenon allows the calculation of the distance separating the conducting channel from the traps in the insulator as well as their lateral position in the channel [74,75,76,77]. The depths of the traps have been estimated to be in the order of a few nm [74] which allows tunneling between the inversion layer and traps in the insulator.…”