A Lumped-Charge Approach Based Physical SPICE-Model for High Power Soft-Punch Through IGBT

Duan, Yaoqiang; Xiao, Fei; Luo, Yong; Iannuzzo, Francesco

doi:10.1109/jestpe.2018.2874105

Cited by 25 publications

(11 citation statements)

References 22 publications

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“…In [127], a model was presented of the switching on/off dynamics of an IGBT. The temperature dependence of this switching on/off behaviour was modelled for high power IGBTs in [128,129]. Models were presented for determining the conduction and switching losses in [130] for the IGBT and in [131] for the IGCT.…”

Section: Power Electronic Convertermentioning

confidence: 99%

Digital Twins for Wind Energy Conversion Systems: A Literature Review of Potential Modelling Techniques Focused on Model Fidelity and Computational Load

et al. 2021

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The Industry 4.0 concept of a Digital Twin will bring many advantages for wind energy conversion systems, e.g., in condition monitoring, predictive maintenance and the optimisation of control or design parameters. A virtual replica is at the heart of a digital twin. To construct a virtual replica, appropriate modelling techniques must be selected for the turbine components. These models must be chosen with the intended use case of the digital twin in mind, finding a proper balance between the model fidelity and computational load. This review article presents an overview of the recent literature on modelling techniques for turbine aerodynamics, structure and drivetrain mechanics, the permanent magnet synchronous generator, the power electronic converter and the pitch and yaw systems. For each component, a balanced overview is given of models with varying model fidelity and computational load, ranging from simplified lumped parameter models to advanced numerical Finite Element Method (FEM)-based models. The results of the literature review are presented graphically to aid the reader in the model selection process. Based on this review, a high-level structure of a digital twin is proposed together with a virtual replica with a minimum computational load. The concept of a multi-level hierarchical virtual replica is presented.

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Section: Power Electronic Convertermentioning

confidence: 99%

Digital Twins for Wind Energy Conversion Systems: A Literature Review of Potential Modelling Techniques Focused on Model Fidelity and Computational Load

et al. 2021

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“…A detailed overview of the modeling techniques and different complexity levels of IGBT models can be found in [153,154]. Although several physical and behavioral models of the coupled MOSFET-BJT structure of an IGBT device are presented in the literature [145,146,[155][156][157][158][159][160][161][162][163][164][165][166][167], the parameter extraction procedures ask for simultaneous fitting to both static and dynamic device measurement data, which makes the modeling of IGBTs a rather complex task even for major manufacturers. Quite a few of them provide models of some IGBT devices (e.g., [165,166]) but the accuracy and stability of these models differ and the selection of an appropriate model for system level EMC simulations is still challenging.…”

Section: Power Semiconductor Modelsmentioning

confidence: 99%

EMC Component Modeling and System-Level Simulations of Power Converters: AC Motor Drives

et al. 2021

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EMC simulations are an indispensable tool to analyze EMC noise propagation in power converters and to assess the best filtering options. In this paper, we first show how to set up EMC simulations of power converters and then we demonstrate their use on the example of an industrial AC motor drive. Broadband models of key power converter components are reviewed and combined into a circuit model of the complete power converter setup enabling detailed EMC analysis. The approach is demonstrated by analyzing the conducted noise emissions of a 75 kW power converter driving a 45 kW motor. Based on the simulations, the critical impedances, the dominant noise propagation, and the most efficient filter component and location within the system are identified. For the analyzed system, maxima of EMC noise are caused by resonances of the long motor cable and can be accurately predicted as functions of type, length, and layout of the motor cable. The common-mode noise at the LISN is shown to have a dominant contribution caused by magnetic coupling between the noisy motor side and the AC input side of the drive. All the predictions are validated by measurements and highlight the benefit of simulation-based EMC analysis and filter design.

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“…To describe the electrical characteristics of IGBT under different conditions and temperatures, a lumped-charge IGBT physical model proposed in [21,22] is used to do the circuit simulation. Compared with other physical models for bipolar semiconductor devices, the lumpedcharge model does not use the high-level injection hypothesis, but represents the hole current and electron current separately according to their carrier concentration.…”

Section: Electrical Model In Pspicementioning

confidence: 99%

“…In addition, to describe the electrical characteristics of IGBT at different temperatures, the dependence of the physical parameters on temperature is considered in the model [21,22]. In the PSpice simulator, the lumped-charge physical model of IGBT could be operated at a specific temperature alone.…”

Section: Electrical Model In Pspicementioning

confidence: 99%

“…In the PSpice simulator, the lumped-charge physical model of IGBT could be operated at a specific temperature alone. In the recently presented study [21,22], the static characteristics and switching transient characteristics of the model have been simulated and compared with the experimental results. For transient overload extreme conditions, due to the significant fluctuation of junction temperature, the effects of chip self-heating on the electrical characteristics of IGBT should be further considered.…”

Section: Electrical Model In Pspicementioning

confidence: 99%

See 1 more Smart Citation

Modeling method for electrothermal cosimulation of high‐power IGBT

Jia

Xiao

Duan

et al. 2019

IEEJ Transactions Elec Engng

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To accurately simulate the electrical characteristics of high-power insulated gate bipolar transistor (IGBT) applied under transient overload extreme conditions, this article presents an electrothermal modeling method based on PSpice and Simulink. In this method, the structural parameters of the IGBT module are accurately extracted through a scanning electron microscope, and the corresponding seven-layer RC thermal network model is established in Simulink. Besides, a new lumped-charge physical model is constructed in PSpice, which can accurately describe the electrical behaviors of IGBT at different temperatures by circuit simulation. Then, cosimulation under a multirate simulation strategy is realized through a Matlab script file, which controls both the PSpice circuit simulation and the Simulink thermal simulation. Finally, the method is verified through a shortcircuit experiment on an ABB 3.3 kV/1500 A high-power IGBT module.

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A Lumped-Charge Approach Based Physical SPICE-Model for High Power Soft-Punch Through IGBT

Cited by 25 publications

References 22 publications

Digital Twins for Wind Energy Conversion Systems: A Literature Review of Potential Modelling Techniques Focused on Model Fidelity and Computational Load

Digital Twins for Wind Energy Conversion Systems: A Literature Review of Potential Modelling Techniques Focused on Model Fidelity and Computational Load

EMC Component Modeling and System-Level Simulations of Power Converters: AC Motor Drives

Modeling method for electrothermal cosimulation of high‐power IGBT

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