A low-temperature parylene-to-silicon dioxide bonding technique for high-pressure microfluidics

Çiftlik, Ata Tuna; Gijs, Martinus

doi:10.1088/0960-1317/21/3/035011

Cited by 29 publications

(39 citation statements)

References 43 publications

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“…patterning by O 2 RIE after photolithography) makes parylene an attractive material for microfluidic channel fabrication and sealing. For example, Ciftlik et al reported bonding strength of 10 and 23 MPa after bonding Pyrex wafers to Parylene C layers deposited on silicon-oxide [108] and silicon-nitride (Fig. 5b) [109], respectively.…”

Section: Sealing Using Adhesive Layersmentioning

confidence: 99%

Lab-on-a-chip devices: How to close and plug the lab?

Temiz

Lovchik

Kaigala

et al. 2015

Microelectronic Engineering

410

276

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a b s t r a c tLab-on-a-chip (LOC) devices are broadly used for research in the life sciences and diagnostics and represent a very fast moving field. LOC devices are designed, prototyped and assembled using numerous strategies and materials but some fundamental trends are that these devices typically need to be (1) sealed, (2) supplied with liquids, reagents and samples, and (3) often interconnected with electrical or microelectronic components. In general, closing and connecting to the outside world these miniature labs remain a challenge irrespectively of the type of application pursued. Here, we review methods for sealing and connecting LOC devices using standard approaches as well as recent state-of-the-art methods. This review provides easy-to-understand examples and targets the microtechnology/engineering community as well as researchers in the life sciences.

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Section: Sealing Using Adhesive Layersmentioning

confidence: 99%

Lab-on-a-chip devices: How to close and plug the lab?

Temiz

Lovchik

Kaigala

et al. 2015

Microelectronic Engineering

410

276

View full text Add to dashboard Cite

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“…103 Parylene is a thermoplastic material which has been used in MEMS wafer-bonding processes. 104 The material has been applied to microfluidic device fabrication for bonding glass to glass 105 and glass to silicon 106 at temperatures of 280-350 C. Parylene has seen other microfluidic applications as well. 107,108 The main advantages of Parylene C are its good thermal stability, good chemical resistance, and relatively strong bonding compared with SU-8: pull tests have shown a bonding strength of around 10 MPa and a maximum burst pressure of 7.6 MPa (Ref.…”

Section: Adhesive Bondingmentioning

confidence: 99%

“…107,108 The main advantages of Parylene C are its good thermal stability, good chemical resistance, and relatively strong bonding compared with SU-8: pull tests have shown a bonding strength of around 10 MPa and a maximum burst pressure of 7.6 MPa (Ref. 106). Parylene can be deposited in thin layers by chemical vapour deposition and can be patterned by dry etching through a photoresist mask.…”

Section: Adhesive Bondingmentioning

confidence: 99%

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A practical guide for the fabrication of microfluidic devices using glass and silicon

Iliescu¹,

Taylor²,

Avram³

et al. 2012

Biomicrofluidics

302

207

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This paper describes the main protocols that are used for fabricating microfluidic devices from glass and silicon. Methods for micropatterning glass and silicon are surveyed, and their limitations are discussed. Bonding methods that can be used for joining these materials are summarized and key process parameters are indicated. The paper also outlines techniques for forming electrical connections between microfluidic devices and external circuits. A framework is proposed for the synthesis of a complete glass/silicon device fabrication flow. I. WHY USE SILICON AND GLASS IN MICRO-AND NANO-FLUIDIC APPLICATIONS?Micro-and nano-fluidic technology continues to be embraced by biologists, 1-3 chemists, 4 and engineers throughout academia and industry. As its applications have expanded, there has been an explosion in the range of materials and processes used to fabricate these devices. The earliest microfluidic devices (e.g., gas 5 and liquid 6 chromatography devices) were made from silicon and glass and borrowed processes directly from semiconductor and microelectromechanical systems (MEMS) manufacturing. 7 Now, however, many researchers have moved away from silicon and glass, and instead use cast elastomers such as polydimethylsiloxane (PDMS)-which is ideal for swift prototyping-or thermoplastic polymers, which can be hot-embossed or injection-molded and are well suited to inexpensive manufacturing. Yet, there remain many applications where glass and silicon offer advantages over polymeric materials. In this paper, we highlight these advantages and offer a framework for selecting fabrication processes when using silicon and glass. A. The dominance of soft lithographyOver the last decade, PDMS has become virtually the default material for forming microfluidic devices, 8 because of the sheer ease with which it can be cast on to a micro-scale mould and then strongly bonded to glass. 9 The elastomeric nature of the material has been exploited to integrate fluidic valves and pumps on-chip and has simplified the production of multi-layer devices because the soft layers readily conform to each other. 10,11 Yet, the low stiffness (usually <1 MPa) of PDMS relative to amorphous thermoplastics, silicon, and glass has its own a) Authors to whom correspondence should be addressed. Electronic addresses: ciliescu@ibn.a-star.edu.sg and hkt@ntu.edu.sg. 6, 016505 (2012) drawbacks. High aspect-ratio channels are notoriously difficult to fabricate in PDMS because of their propensity to collapse. 12 Moreover, difficulties in automating the handling of such a soft material have hampered efforts to scale up PDMS device manufacturing. Meanwhile, PDMS's high oxygen and water permeabilities have proved both a blessing and a curse in different applications.The hydrophobic nature of PDMS can be an important consideration for some biological applications. In drug screening applications, for example, hydrophobic drugs as well as metabolites (urea or albumin) can be absorbed into the device's material due to hydrophobic--hydrophobic interaction...

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“…São encontradas algumas apresenta baixa constante dielétrica e grande resistência química [64] . As aplicações do Parylene vão de dispositivos da microeletrônica, sensores e dispositivos microfluídicos diversos, com funções de substrato, material de encapsulamento e região ativa para sensores [65,66,67] .…”

Section: O Parylene é O Nome De Um Conjunto De Produtos Derivados Do unclassified

Sistemas microfluídicos aplicados na produção de micro e nanopartículas.

Schianti¹

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A low-temperature parylene-to-silicon dioxide bonding technique for high-pressure microfluidics

Cited by 29 publications

References 43 publications

Lab-on-a-chip devices: How to close and plug the lab?

Lab-on-a-chip devices: How to close and plug the lab?

A practical guide for the fabrication of microfluidic devices using glass and silicon

Sistemas microfluídicos aplicados na produção de micro e nanopartículas.

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