2016
DOI: 10.1109/led.2016.2614514
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A Low On-State Voltage and Saturation Current TIGBT With Self-Biased pMOS

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Cited by 12 publications
(12 citation statements)
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“…The doping concentration of the N-cs (N ncs ) is still limited. In [15], [16], clamping the potential of nMOS's intrinsic drain with self-biased pMOS allows a further increasing N ncs and decreases the saturation current density, as the D ncs doesn't need to be completely depleted when sustaining high voltage.…”
Section: Introductionmentioning
confidence: 99%
“…The doping concentration of the N-cs (N ncs ) is still limited. In [15], [16], clamping the potential of nMOS's intrinsic drain with self-biased pMOS allows a further increasing N ncs and decreases the saturation current density, as the D ncs doesn't need to be completely depleted when sustaining high voltage.…”
Section: Introductionmentioning
confidence: 99%
“…V on of TIGBT could be further reduced by introducing a heavily doped N-type carrier stored layer (N-layer) [1]. Although V on decreases as the dose of the N-layer (D NL ) increases, D NL could not be too high due to it strongly affects the breakdown voltage (BV) [2][3][4][5]. In addition, in order to improve the short-circuit safe operating area, the saturation current of TIGBT needs to be decreased, which could be achieved by clamping the drain-to-source voltage (V DS ) of the trench nMOS [3,4,6].…”
mentioning
confidence: 99%
“…Although V on decreases as the dose of the N-layer (D NL ) increases, D NL could not be too high due to it strongly affects the breakdown voltage (BV) [2][3][4][5]. In addition, in order to improve the short-circuit safe operating area, the saturation current of TIGBT needs to be decreased, which could be achieved by clamping the drain-to-source voltage (V DS ) of the trench nMOS [3,4,6]. However, clamping V DS by depleting the N-layer or by a selfbiased pMOS would limit the value of D NL , and thus limit the further reduction in V on [3,6].…”
mentioning
confidence: 99%
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