2000
DOI: 10.1016/s0038-1101(99)00266-x
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A low-complexity 62-GHz fT SiGe heterojunction bipolar transistor process using differential epitaxy and in situ phosphorus-doped poly-Si emitter at very low thermal budget

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Cited by 25 publications
(12 citation statements)
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“…The P atoms cannot be cleared by hydrogen; this can be explained by the formation of stable P complexes on the surface. By changing parameters such as temperature, pressure, purge time would be helpful [ 24 , 40 ], but too long purge time is not suitable due to time cost, and high temperature (> 950 °C) causes Si-Ge interdiffusion [ 41 ].
Fig.
…”
Section: Resultsmentioning
confidence: 99%
“…The P atoms cannot be cleared by hydrogen; this can be explained by the formation of stable P complexes on the surface. By changing parameters such as temperature, pressure, purge time would be helpful [ 24 , 40 ], but too long purge time is not suitable due to time cost, and high temperature (> 950 °C) causes Si-Ge interdiffusion [ 41 ].
Fig.
…”
Section: Resultsmentioning
confidence: 99%
“…The Si/Ge heterojunction bipolar transistor process using differential epitaxy and in situ phosphorus-doped poly-Si emitter [14] at very low thermal budget is designed.…”
Section: Resultsmentioning
confidence: 99%
“…SiGe alloys have been used in many electronic devices, such as stressor and high mobility channel materials, for years. Both Ge or SiGe layers could be grown selectively in trenches or around SiNWs as core layer (Grahn et al, 2000;Hållstedt et al, 2008b;Radamson and Kolahdouz, 2015). The interface between core and shell reduces thermal conductivity by phonon scattering.…”
Section: Core-shell (C-s)mentioning
confidence: 99%