A high efficiency 0.25 mu m pseudomorphic HEMT power process

Danzilio, D.; White, Paul M.; Hanes, L.K.; Lauterwasser, B.; Ostrowski, B.; Rose, F.

doi:10.1109/gaas.1992.247269

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Cited by 9 publications

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“…A microstrip patch antenna electromagnetically fed by a microstrip line through a nonresonant rectangular slot on the ground plane of the antenna was proposed by Pozar [2]. This feeding technique isolates the feed network form the radiating patches, and as a result, unwanted radiation from the feed lines can be separated.…”

Section: Introductionmentioning

confidence: 99%

Offset tripatch microstrip antenna

Tong¹,

Luk²

1994

Micro & Optical Tech Letters

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Section: Introductionmentioning

confidence: 99%

Offset tripatch microstrip antenna

Tong¹,

Luk²

1994

Micro & Optical Tech Letters

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show abstract

Compound Semiconductor Device Processing

Parsey

2013

Materials Science and Technology

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The sections in this article are Introduction Doping Processes Ion Implantation Diffusion Methods Epitaxial Methods Isolation Methods Mesa Etching Ion Implantation Isolation Sidegating and Backgating Diffusion Etching Techniques Wet Etching Dry Etching Ohmic Contacts Schottky Barriers and Gates Annealing Dielectrics and Interlayer Isolation Resistors Metallization and Liftoff Processes Metallization Liftoff Processes Backside Processing and Die Separation Backside Processing Die Separation

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Compound Semiconductor Device Processing

Parsey

1998

Compound Semiconductor Devices

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A high efficiency 0.25 mu m pseudomorphic HEMT power process

Cited by 9 publications

References 4 publications

Offset tripatch microstrip antenna

Offset tripatch microstrip antenna

Compound Semiconductor Device Processing

Compound Semiconductor Device Processing

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