A hermetic glass-silicon micropackage with high-density on-chip feedthroughs for sensors and actuators

Getter free vacuum packaging for MEMS

“…where A f is the accelerated factor, which is widely used by Eq. (1.10) under high temperature and high humidity soaks testing [33].…”

Thermo-mechanical properties of alumina films created using the atomic layer deposition technique

“…4, is fabricated at a commercial foundry from an Al layer with a line and space of 5 m. The leakage current monitor is encapsulated at the wafer level so that ALD surface coatings can be added directly on the WLE to act as a barrier to moisture. This approach to validate the WLE has been previously used to examine thin film [74,77] and wafer bonded [75,76] encapsulation schemes.…”

“…The interdigitated structure has traditionally enabled dew point detection during plastic package qualification [71][72][73]. After calibration in a temperature-and moisture-controlled environment, the same structure may function as a humidity sensor, whether encapsulated by a permeable polymeric layer [74] or direct exposed to the environment [75,76]. In the direct ambient, monolayers of water at the surface may facilitate electric current.…”

Bonding quartz wafers by the atom transfer radical polymerization of the glycidyl methacrylate at mild temperature

“…Anodic bonding [30] has been widely used for protecting on-board electronics in biosensors [31,32] and sealing cavities in pressure sensors [33], which offers a bonding temperature of about 200-400 • C and requires the aid of a high electrical field in the region of 700-2000 V to achieve high-quality bonds. The high voltage used in the anodic bonding has great influence on the integrate circuits on the silicon wafer.…”