Abstract:We realized a fully integrated 25Gb/s Si ring modulator transmitter containing a temperature controller that guarantees the optimal ring modulator temperature against any temperature perturbation. The transmitter is implemented with a 0.25-μm photonic BiCMOS technology.
“…Therefore, it is necessary to stabilize the resonant wavelength of the MRR in a variety of different environments. The closed-loop feedback control loop [113,115,116,[120][121][122][123][124][125][126] is often used to lock the resonant wavelength of the MRR, MRPD, and MRM. However, there is almost no work that can simultaneously compensate for fabrication variations, thermal fluctuations, input laser wavelength/power variations, and random data patterns.…”
Section: Current and Future Challengesmentioning
confidence: 99%
“…To implement effective closed-loop thermal tuning for MRR, the relative position of the resonant wavelength and laser wavelength must be obtained using a monitor, such as photodiode [115] and contactless integrated photonic probe (CLIPP) [130]. Secondly, a controller is required to generate the control signal to align the resonance wavelength according to a suitable algorithm [115,116,[121][122][123][124]131] or analog control circuit [120]. To increase the tuning temperature range, a driver is required to provide sufficient current to heat the integrated resistor, thereby tuning the resonance wavelength through the thermo-optic effect [113,132].…”
Section: Advances In Science and Technology To Meet Challengesmentioning
Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slower rate than that of datacenter traffic. The gap between application requirements and the capability of conventional pluggable optics keeps increasing, a trend that is unsustainable. Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. CPO is widely regarded as a promising solution for future datacenter interconnections, and silicon platform is the most promising platform for large-scale integration. Leading international companies (e.g., Intel, Broadcom and IBM) have heavily investigated in CPO technology, an inter-disciplinary research field that involves photonic devices, integrated circuits design, packaging, photonic device modeling, electronic-photonic co-simulation, applications, and standardization. This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform, identify the key challenges, and point out the potential solutions, hoping to encourage collaboration between different research fields to accelerate the development of CPO technology.
Graphical Abstract
“…Therefore, it is necessary to stabilize the resonant wavelength of the MRR in a variety of different environments. The closed-loop feedback control loop [113,115,116,[120][121][122][123][124][125][126] is often used to lock the resonant wavelength of the MRR, MRPD, and MRM. However, there is almost no work that can simultaneously compensate for fabrication variations, thermal fluctuations, input laser wavelength/power variations, and random data patterns.…”
Section: Current and Future Challengesmentioning
confidence: 99%
“…To implement effective closed-loop thermal tuning for MRR, the relative position of the resonant wavelength and laser wavelength must be obtained using a monitor, such as photodiode [115] and contactless integrated photonic probe (CLIPP) [130]. Secondly, a controller is required to generate the control signal to align the resonance wavelength according to a suitable algorithm [115,116,[121][122][123][124]131] or analog control circuit [120]. To increase the tuning temperature range, a driver is required to provide sufficient current to heat the integrated resistor, thereby tuning the resonance wavelength through the thermo-optic effect [113,132].…”
Section: Advances In Science and Technology To Meet Challengesmentioning
Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slower rate than that of datacenter traffic. The gap between application requirements and the capability of conventional pluggable optics keeps increasing, a trend that is unsustainable. Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. CPO is widely regarded as a promising solution for future datacenter interconnections, and silicon platform is the most promising platform for large-scale integration. Leading international companies (e.g., Intel, Broadcom and IBM) have heavily investigated in CPO technology, an inter-disciplinary research field that involves photonic devices, integrated circuits design, packaging, photonic device modeling, electronic-photonic co-simulation, applications, and standardization. This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform, identify the key challenges, and point out the potential solutions, hoping to encourage collaboration between different research fields to accelerate the development of CPO technology.
Graphical Abstract
“…The monitor senses the operating state of the photonic devices. Various techniques have been proposed in the literature: (1) on-chip photodetectors (PDs) to monitor the light intensity at the output ports [25][26][27][28][29][30] ; (2) on-chip temperature sensor [31][32][33] ; (3) in-resonator photoconductive heaters (IRPHs) to monitor the light intensity in the waveguide [34][35][36] ; (4) Contact less integrated photonic probe (CLIPP) to measure the light-intensity-dependent change of waveguide's electrical conductivity [37][38][39] .…”
As Moore’s law approaching its end, electronics is hitting its power, bandwidth, and capacity limits. Photonics is able to overcome the performance limits of electronics but lacks practical photonic register and flexible control. Combining electronics and photonics provides the best of both worlds and is widely regarded as an important post-Moore’s direction. For stability and dynamic operations considerations, feedback tuning of photonic devices is required. For silicon photonics, the thermo-optic effect is the most frequently used tuning mechanism due to the advantages of high efficiency and low loss. However, it brings new design requirements, creating new design challenges. Emerging applications, such as optical phased array, optical switches, and optical neural networks, employ a large number of photonic devices, making PCB tuning solutions no longer suitable. Electronic-photonic-converged solutions with compact footprints will play an important role in system scalability. In this paper, we present a unified model for thermo-optic feedback tuning that can be specialized to different applications, review its recent advances, and discuss its future trends.
“…These factors impact the performance of both the MRMs and MRPDs, by shifting the resonance wavelengths, hence influencing their operating point (OP). To operate such devices reliably in realistic applications, MRR resonance wavelengths are actively controlled using built-in resistors used as ohmic heaters [56] and a closed feedback loop [9,57].…”
Section: Mrr Thermal Stabilizationmentioning
confidence: 99%
“…5 (a) and (b). Existing solutions rely on resistive heaters which require a linear regulator [14,17,50,57]. However, such linear regulators waste power as heat in their regulation transistors [58].…”
As the reach of optical communications continues to shrink, photonics is moving from rack-to-rack datacom links to centimeter-scale in-computer applications (computercom) where different architectures are needed. Integrated optical microring resonators (MRRs) are emerging as an attractive choice for fulfilling the more stringent area and efficiency requirements: They offer scaling by wavelength division multiplexing (WDM) and high bandwidth densities. In this paper we present compact electro-optical transmit (TX) and receive (RX) macros for computercom monolithically integrated in 45nm CMOS. They operate with MRR modulators and photodetectors and include all necessary electronics and optics to enable optical links between on-chip data sources and sinks. A most compact implementation for thermal stabilization was enabled by sensing the optical device's bias currents in the driving electronics instead of using external operating point sensing optics. Using a field-effect transistor as heating element -as is possible in monolithic integration platforms -further reduces area and power necessary for thermal control. The TX macro is shown to work for data rates up to 16 Gb/s with a 5.5 dB extinction ratio (ER) and 2.4 dB insertion loss (IL). The RX macro demonstrates a sensitivity of 71 µApp at 12 Gb/s for a BER ≤ 10 -10 . An intra-chip link built with the macros achieves ≤ 2.35 pJ/b electrical efficiency and a BER ≤ 10 -10 at 10 Gb/s. Both macros are realized within 0.0073 mm 2 which amounts to 1.4 Tb/s/mm 2 bandwidth density per macro.
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