A full-duplex ultrasonic through-wall communication and power delivery system

Ashdown, Jonathan; Wilt, K. R.; Lawry, T. J.; Saulnier, G.J.; Shoudy, David; Scarton, H. A.; Gavens, A. J.

doi:10.1109/tuffc.2013.2600

Cited by 44 publications

(31 citation statements)

References 9 publications

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“…The comparison shows that the power dissipation of the proposed system is an order of magnitude lower than other systems. If a figure-of-merit (FOM) is defined as FOM = D Com S PZT × S Sys × P Sys (8) where D Com is the communication distance, S PZT and S Sys are sizes of PZT and system, respectively, and P Sys is power consumption of the system, the proposed design is two orders of magnitude superior to that of [16]. Note that the FOM metric could not be computed for other references in Table III, because some of the experimental parameters were not reported.…”

Section: Discussionmentioning

confidence: 99%

Design of a CMOS System-on-Chip for Passive, Near-Field Ultrasonic Energy Harvesting and Back-Telemetry

Feng

Lajnef

Chakrabartty

2016

IEEE Trans. VLSI Syst.

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Many packaging and structural materials are made of conductive materials such as metal or carbon-fiber composites, which limits the use of embedded radio frequency-based telemetry systems for sensing. In this paper, we present the design of a complete passive ultrasonic energy harvesting and back-telemetry system that exploits near-field acoustic coupling to wirelessly transfer energy and data across conductive barriers. The use of near-field operation makes the telemetry robust to multipath reflections that occur at barrier discontinuities and robust to crosstalk when multiple sensors are simultaneously interrogated. Underlying the proposed architecture is a systemon-chip (SoC) that integrates different ultrasonic energy harvesting and telemetry modules. The operation of the system has been verified using SoC prototypes fabricated in a 0.5-µm CMOS process which have been integrated with a piezoelectric transducer attached to an aerospace-grade aluminum substrate. Measured results show that the proposed near-field ultrasonic telemetry system can effectively operate across a 2-mm-thick metallic barrier at a frequency of 13.56 MHz with the SoC consuming 22.3 µW of power.Index Terms-Energy scavenging, Mason model, near-field back-telemetry, structural health monitoring, ultrasonic communication.

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Section: Discussionmentioning

confidence: 99%

Design of a CMOS System-on-Chip for Passive, Near-Field Ultrasonic Energy Harvesting and Back-Telemetry

Feng

Lajnef

Chakrabartty

2016

IEEE Trans. VLSI Syst.

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“…Almost at the same time the research group at Rensselaer Polytechnic Institute extended the focus from ultrasonic communications through metal barriers to the development of a high performance system for through metal transmission of power and data [ 67 , 68 , 69 , 70 , 71 , 72 , 73 , 74 , 75 , 76 , 77 , 78 , 79 , 80 , 81 , 82 , 83 ]. This group has carried out in-depth research on this topic including modeling of this acoustic-electric channel, high-data-rate communication, and simultaneous power delivery and duplex communication, and etc .…”

Section: Ultrasonic Through-metal-wall Power Delivery and Data Tramentioning

confidence: 99%

“…The majority of the publications only achieve half-duplex data transmission over this channel. The group at Rensselaer Polytechnic Institute proposed a novel way to achieve full-duplex data transmission [ 81 , 82 ] using a pair of coaxially aligned 25.4 mm PZTs with 1 MHz nominal resonant frequencies. Due to the channel frequency selectivity, a carrier frequency selection and tracking algorithm was presented to choose a frequency of operation at which both adequate power delivery and reliable full-duplex communication were achieved.…”

Section: Comparison Of Various Ultrasonic Through-metal-wall Powermentioning

confidence: 99%

Through-Metal-Wall Power Delivery and Data Transmission for Enclosed Sensors: A Review

Yang

Zhao

et al. 2015

Sensors

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The aim of this review was to assess the current viable technologies for wireless power delivery and data transmission through metal barriers. Using such technologies sensors enclosed in hermetical metal containers can be powered and communicate through exterior power sources without penetration of the metal wall for wire feed-throughs. In this review, we first discuss the significant and essential requirements for through-metal-wall power delivery and data transmission and then we: (1) describe three electromagnetic coupling based techniques reported in the literature, which include inductive coupling, capacitive coupling, and magnetic resonance coupling; (2) present a detailed review of wireless ultrasonic through-metal-wall power delivery and/or data transmission methods; (3) compare various ultrasonic through-metal-wall systems in modeling, transducer configuration and communication mode with sensors; (4) summarize the characteristics of electromagnetic-based and ultrasound-based systems, evaluate the challenges and development trends. We conclude that electromagnetic coupling methods are suitable for through thin non-ferromagnetic metal wall power delivery and data transmission at a relatively low data rate; piezoelectric transducer-based ultrasonic systems are particularly advantageous in achieving high power transfer efficiency and high data rates; the combination of more than one single technique may provide a more practical and reliable solution for long term operation.

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“…The ability to steadily communicate through thick metal walls without physical penetration would provide great potential benefit to many sensing and condition monitoring applications in rugged environments [1]. These matters may be avoided by using ultrasonic to transmit both power and data.…”

Section: Introductionmentioning

confidence: 99%

Identification and Communication Simulation of an Ultrasonic Through-metal-wall Channel

Tian¹,

Yang²,

Hou³

2017

Proceedings of the 2nd International Conference on Computer Engineering, Information Science &Amp; Application Technology (ICCI

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Abstract. Many industrial applications need the technologies of power and data transmission through metal barriers without physical penetrations. The reverberation of the acoustic signals in the channel can produce multipath distortion with a significant delay spread that introduces severe inter-symbol interference into the signal. To overcome this shortage, we did a more detailed study of the channel's characteristics. The voltage transfer function and impulse response of the same channel were obtained. The response signal was used for system identification, and then a more accurate model of the ultrasonic channel was built. An equalizer was directly derived based on the identified model. The equalizer's superb results on echoes cancellation is simulated and verified using ASK modulation schemes in Simulink. The results show that data rates on the order of 100kbps at least. By choosing a discrete time representation of the system, the resulting equalizer is readily implemented on FPGA.

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A full-duplex ultrasonic through-wall communication and power delivery system

Cited by 44 publications

References 9 publications

Design of a CMOS System-on-Chip for Passive, Near-Field Ultrasonic Energy Harvesting and Back-Telemetry

Design of a CMOS System-on-Chip for Passive, Near-Field Ultrasonic Energy Harvesting and Back-Telemetry

Through-Metal-Wall Power Delivery and Data Transmission for Enclosed Sensors: A Review

Identification and Communication Simulation of an Ultrasonic Through-metal-wall Channel

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