A flexible technology platform for the fabrication of RF-MEMS devices

Giacomozzi, F.; Mulloni, Viviana; Colpo, S.; Iannacci, Jacopo; Margesin, B.; Faes, A.

doi:10.1109/smicnd.2011.6095744

Cited by 38 publications

(45 citation statements)

References 3 publications

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“…Figure shows the proposed LC resonator. It consists of the series of a spiral inductor and a varactor, both designed to be fabricated by using the FBK‐irst MEMS process [ Giacomozzi et al ., ]. The bonding wire interconnections with the active part of the VCO have been also included in the model since they are the main responsible of the shift of the resonance frequency of the circuit.…”

Section: Resonator Geometrymentioning

confidence: 99%

“…are polarized. They are made by the stuck of the thin metal and insulating layers available in the standard process [ Giacomozzi et al ., ], such as polysilicon, TiN/Ti/Al/Ti/TiN multimetal, and gold for a total height of about 1.2 µm.…”

Section: Resonator Geometrymentioning

confidence: 99%

“…The technology, originally developed for high‐reliability RF‐MEMS switches for space applications, is able to produce complex RF circuits including MEMS switches and high‐quality passive components in large quantities and at low cost. The main structural elements that characterize the process are a 2 µm and a 3.5 µm thick galvanic gold layer that provides the high‐conductivity transmission lines and, in combination with the sacrificial layer, the mobile suspended structures used to build the electrostatically actuated switches [ Giacomozzi et al ., ]. For the construction of the silicon membranes a process module has been added that consists in an aluminum hard mask on the wafer backside followed by a timed silicon etch with a DRIE process that has been carefully tuned in order to leave a 50 µm thick silicon membrane.…”

Section: Fabricationmentioning

confidence: 99%

See 2 more Smart Citations

MEMS‐based LC tank with extended tuning range for multiband applications

Cazzorla

Farinelli²,

Urbani³

et al. 2016

Radio Science

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This paper presents the modeling, simulations, and measurements of a compact multiband microelectromechanical (MEMS)‐based LC tank resonator suitable for low phase noise voltage‐controlled oscillators (VCOs). The resonator is based on a high‐Q spiral inductor and high capacitance ratio varicap fully integrated in FBK‐irst (Fondazione Bruno Kessler) MEMS manufacturing process. The design of the varicap is based on double‐actuation mechanism with a mechanical central bond that inhibits the pull‐in allowing for a theoretically infinite tuning ratio. The measurements have shown a total not continuous capacitance ratio (Cr) of 5.2 with a continuous variation of the capacitance values in the range 225 fF–600 fF which corresponds to a continuous capacitance ratio (Cr*) of 2.6. The performance repeatability, the power‐handling capability, and the stability over time were tested on 10 samples showing a negligible variation of the capacitance values. The spiral inductor consists of a suspended gold membrane thick 5 µm in a circular shape which was modeled in order to optimize the quality factor (Q) in the frequency range 2–4 GHz. The measurement results show a Q of about 55 in the 2–4 GHz frequency band. The LC tank measurements show an overall tuning range better than of 45% in the 3.2–4.9 GHz frequency band, consisting of two continuous tuning ranges of 7.5% and 25%. The LC tank allowed the design of MEMS‐based voltage‐controlled oscillators (VCOs) with an overall tuning better than 60% in the frequency range 2.15 GHz–3.85 GHz and two separate regions of continuous tuning range. The VCO prototype will be fabricated on Surface Mount Technology on RO4350 laminate. The main figures of merit are presented in comparison with the state of the art.

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Section: Resonator Geometrymentioning

confidence: 99%

Section: Resonator Geometrymentioning

confidence: 99%

Section: Fabricationmentioning

confidence: 99%

See 1 more Smart Citation

MEMS‐based LC tank with extended tuning range for multiband applications

Cazzorla

Farinelli²,

Urbani³

et al. 2016

Radio Science

Self Cite

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“…The switches were fabricated by FBK using a combination of CMOS and micromachining processes on 200-μm thick high-resistivity silicon [9]. With respect to the devices presented in [7], the new SP4Ts dies are provided with 0-level package.…”

Section: Modeling and Designmentioning

confidence: 99%

A 0–10GHz SP16T MEMS switch for switched beam satellite antenna systems

Farinelli¹,

Ghannudi²,

Cazzorla

et al. 2014

2014 44th European Microwave Conference

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This paper presents the design, manufacturing and testing of a MEMS SP16T switch to be used in open loop reconfigurable antenna systems. It consists of the hybrid integration of #5 MEMS SP4T switches (realized on HR Silicon substrate) on a multilayer substrate. The bilayer structure allows one to avoid RF and DC signal crossovers that could degrade the switch performance. The device is provided with SMA connectors and Control Electronic Board to operate with standard 0-5V signals. A wideband device was developed, working from DC up to 10GHz. The switch has been designed using both circuital and full-wave EM models. The simulations are presented in comparison with the measured performance. The SP16T switch shows return and insertion loss better than 12dB and 3.2dB, isolation better than 24dB from 0 up to 10GHz. Tests on the actual antenna systems are on-going.

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“…The switches were manufactured by FBK on 200µm thick HR Silicon substrates. An 8 mask level process has been used which allows the fabrication of capacitive and ohmic MEMS switches together with passive components on the same substrate [5]. A device yield of about 80% could be achieved.…”

Section: Introductionmentioning

confidence: 99%

Compact 12×12 Switch Matrix integrating RF MEMS switches in LTCC hermetic packages

Diaferia

Deborgies

Nardo

et al. 2014

2014 44th European Microwave Conference

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A 12x12 Switch Matrix Unit featuring silicon RF MEMS assembled on LTCC boards has been developed under a Contract with the European Space Agency (ESA) for satellite communication application. The Switch Matrix is a complete Engineering Model unit, housed in a mechanical box in aluminum with RF coaxial connectors and DC connectors for powering and commanding. To the authors' knowledge, it is the first complex equipment realized in Europe exploiting the advanced features of the RF MEMS and multilayer LTCC technology to achieve a significant mass and size reduction. Full wave simulations of entire structure are reported, as well as test results. Their agreement is good up to the satellite downlink Cband (3.7-4.2 GHz). An insertion loss of -20dB, return loss of -10dB and isolation of 40-45dB have been measured. The matrix is passive (not provided with amplifiers), having a DC power consumption of less than half watt due to the digital command circuitry.

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A flexible technology platform for the fabrication of RF-MEMS devices

Cited by 38 publications

References 3 publications

MEMS‐based LC tank with extended tuning range for multiband applications

MEMS‐based LC tank with extended tuning range for multiband applications

A 0–10GHz SP16T MEMS switch for switched beam satellite antenna systems

Compact 12×12 Switch Matrix integrating RF MEMS switches in LTCC hermetic packages

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A flexible technology platform for the fabrication of RF-MEMS devices

Cited by 38 publications

References 3 publications

MEMS‐based LC tank with extended tuning range for multiband applications

MEMS‐based LC tank with extended tuning range for multiband applications

A 0&#x2013;10GHz SP16T MEMS switch for switched beam satellite antenna systems

Compact 12&#x00D7;12 Switch Matrix integrating RF MEMS switches in LTCC hermetic packages

Contact Info

Product

Resources

About

A 0–10GHz SP16T MEMS switch for switched beam satellite antenna systems

Compact 12×12 Switch Matrix integrating RF MEMS switches in LTCC hermetic packages